Electronics Forum: squeegee (Page 61 of 73)

Solder at gold finger

Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef

1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto

Stencil Cleaning OnBoard Forum Now In Progress

Electronics Forum | Thu Mar 01 10:46:11 EST 2001 | davef

Various lint free stencil wipe suppliers take various approaches to stencil cleaning. For instance ... Techspray Directions: Start with a dry TechClean Wipe (2358, 2361, or 2362) to remove excess solder pastes. Follow this with the 1608 Pre-Saturat

60 Deg or 45 Deg Blades

Electronics Forum | Wed Mar 07 20:43:55 EST 2001 | davef

Sure, the rolling action of the paste creates a weak magnetic field surrounding the paste. This is similar the field created by electric current flowing through a wire, as first described by James Maxwell. After creation of the magnetic flux, the m

Re: Step-down stencil Versus Reduced Aperture Design

Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon

| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re

Re: Paste Printing @ 45 degrees

Electronics Forum | Sat Aug 14 07:01:44 EDT 1999 | Earl Moon

| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I know we all seek easy/better solut

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt

| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no

Re: bare board problem

Electronics Forum | Fri Jun 18 10:24:12 EDT 1999 | John Thorup

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: Printing Adhesive

Electronics Forum | Wed May 05 14:24:24 EDT 1999 | Mark Lessig

Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. Printing of adhesives are as easy as printing

Re: Printing Adhesive

Electronics Forum | Thu May 06 09:17:30 EDT 1999 | Sokkhon Ou

| Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. | Printing of adhesives are as easy as prin

Re: Printing Adhesive

Electronics Forum | Fri May 07 12:58:31 EDT 1999 | John Staley

| Kevin, I also work for a major adhesive manufacturer and would be pleased to send you several technical papers and some basic equipment settings for printing adhesives. If you will leave you name and mailing address on my voice mail (800)323-6106


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