Electronics Forum | Mon Mar 10 10:28:23 EST 2003 | pjc
Tact times published by placement equipment suppliers usually do not account for board load/unload. Placement time standards set for your boards must include load/unload time. I measure from first fiducial read on board 1 to first fiducial read on bo
Electronics Forum | Thu Mar 20 16:59:10 EST 2003 | MA/NY DDave
Hi Read those guides again and then give IPC a call to see if they can direct you to any other materials. This stuff is quite old so they should have lots. The Mil does also. IPC does have a Designers Council that serves your area. Give the leaders
Electronics Forum | Thu Jun 19 10:22:53 EDT 2003 | A J. Morin ...of A. R. T. (Automation Resources & Technologies)
I would like to say that if anyone is having problems getting technical support service for their equipment and have not registered their equipment and paid that fee,you may get service by contacting A J Morin (of ART) and we may be able to service y
Electronics Forum | Tue Jul 15 22:50:12 EDT 2003 | iman
We have an internal engineering study on blowhole solder joints and had helped reduce the problem to pinholes symtoms. The pinhole occurs in solder joint of a Land-Grid-Array (LGA) side-wall (external perimeter of package) fillets. Our customer is a
Electronics Forum | Fri Aug 22 17:12:40 EDT 2003 | Stephen
read the other messages. I havn't seen this problem nor have I even heard of anyone seeing this problem. If anyone else has seen this on unreflowed BGA's I would love to hear it. At first I thought you meant that your QA department was finding the pr
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Tue Mar 09 13:25:48 EST 2004 | vinhmach1
Hi Sr.Tech. I agree with you every bit but one. Isn't this a U.S. based site ? Then I would like to ask YOU Mr. Sr. Tech. What is http://www. stand for? My 5 years old daughter knows the ... for this evenly English is our Second Language. I am jus
Electronics Forum | Sun Apr 18 05:02:53 EDT 2004 | Rob
Hi, I am a Quality person (Metalwork fabrication and System assembly)but have not had any experience of SMT before. I am trying to put some SPC in place for reflow and others and have come across something I do not understand. Our current SPC Chart c
Electronics Forum | Thu Jun 24 20:28:58 EDT 2004 | needhelp
We design PCBAs. Our CM assembles the boards for us. So far we have used waterwash SMT process to build the boards. Accidentally, due to documentation errors, we suddenly have a huge batch of boards built with No-Clean process. Although the boards pa
