Electronics Forum: standards (Page 131 of 360)

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Minimum space recommended for thru-hole, pad to pad

Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris

In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno

Component Thermal Profiles

Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton

Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo

Re: electroformed stencils

Electronics Forum | Thu Jun 03 15:00:48 EDT 1999 | Deon Nungaray

.020" pitch spacing. Which have yielded my process excelent results. My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. Hope this helps. Deon Nungaray SMT Mfg. Eng

Shear Testing

Electronics Forum | Tue Jun 01 12:57:52 EDT 1999 | John Sims

I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test metho

Reflow Oven Atmosphere Purity

Electronics Forum | Wed May 12 07:56:31 EDT 1999 | Joe Belmonte

Folks, I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. What purity L

Re: CAD 13/14 Compatible PCB Design

Electronics Forum | Tue May 11 12:58:14 EDT 1999 | Dave F

| Would like are to know if there CAD 13/14 compatible PCB design component parts,config standard, schematic symbols, libraries and other software available as freeware, shareware for beginners at PCB design. | | R.L.Ottaway | | RL: There's a f

Re: Need a land pattern

Electronics Forum | Wed May 12 02:22:03 EDT 1999 | Richard Durrant

| Need a footpint for a 10 lead uSOIC (RM-10) | Have you tried the IPC website at www.ipc.com, they have an online land pattern calculator that not only gives you there RLP (Regisistered Land Patterns) for standard components, but also allows you to

Oven Reflow vs Wave Solder

Electronics Forum | Fri Apr 23 11:31:35 EDT 1999 | J.J. Thomas

A customer told me that pad geometry was to be different depending on soldering process. I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should not e

Specialty SMT Feeder

Electronics Forum | Tue Mar 16 14:58:23 EST 1999 | Phil

I am in need of feeder that that will feed a 76mm wide tape @ a 60mm pitch to be used on a Universal GSM. It is not a standard tractor feed, so it would require quite a bit of ingenuity. Does anyone out there know of someone who designs and builds cu


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