Electronics Forum: standards (Page 136 of 360)

EMS Terms and Conditions

Electronics Forum | Sat Dec 15 10:36:25 EST 2001 | clarkk

Tried both, with no success. The big guys are pretty secretive about how they do things. The lawyer understands arbitration and things like that, but doesn't have a clue about customer furnished materials or volume pricing. I have found that IPC is w

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy

Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to

What does MSL 4 on a component package means?

Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy

Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to

Baking time for PCBA rework

Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette

Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w

Solder Paste Inspection System.

Electronics Forum | Thu Feb 28 18:42:35 EST 2002 | Nightbull

Thank you for your reply. Answer: Auditor came to my company and said that we needed a solder deposition tester. The reason was that we had no real way of assuring that our solder process was repeatable. He referred to several IPC standards that mad

Solder Paste Inspection System.

Electronics Forum | Thu Mar 07 17:16:23 EST 2002 | JTorres

Dave, Yes the process is in control or that part that we can control. Visual inspection on first boards and then after a batch. I have had good prints with our current printing machines. My operators are very conscious of there work. Quality control

Screenprinting Adhesives

Electronics Forum | Fri Apr 12 13:22:49 EDT 2002 | mikecollier

I am currently exploring the option of screenprinting chipbonder for backside devices, mostly passives, 0603 and up. Does anyone have any experience with this? What are the pros/cons? What are the stencil design considerations? What about blades,

Waste

Electronics Forum | Thu Apr 18 16:54:45 EDT 2002 | cfraser

Currently in our facility we store used and discarded flux residues from the wave solder machines in 50 gallon drums. These drums are picked up and disposed of by an outside contractor. During a recent audit we were cited for not having the drums

Nitrogen use in reflow and wave

Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez

I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us

Heraeus Benchmarker experiences?

Electronics Forum | Wed May 08 08:45:29 EDT 2002 | pteerink

I have used the benchmarker for solderpaste evaluations, and had very good results. Best results I had were in evaluating the spread, slump and wetting of the pastes. ( of course that is where I had the biggest issue too ) If you are looking to eval


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