Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
Electronics Forum | Fri Oct 29 13:45:03 EDT 1999 | David Vulcano
We are placing several axial components that have STEEL leads. Have noticed that the steel components do not get good flow thru(we manufacture to IPC-A-610 Class II Standards which reqires 75% flow thru) We are using Seho Wave Machines with Nitroge
Electronics Forum | Thu Sep 23 23:34:47 EDT 1999 | JAX
| Is there a standard rule/guide for the orientation of pcb's in a panel for panelised board (specially for routed panel). | i often get this question from peeps here and i kept telling them that it depends on how it affects the process. | thanks and
Electronics Forum | Mon Sep 13 16:39:10 EDT 1999 | Earl Moon
| How is cost per placement calculated? | Let me count the ways. Oh, this is not Jennifer to whom I'm talking. No matter, what's your environement? Is it prototype, high mix/low volume, low mix/high volume, etc.? It could some down to simply calcul
Electronics Forum | Mon Sep 13 02:46:19 EDT 1999 | dreamsniper
I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on th
Electronics Forum | Wed Aug 18 22:01:35 EDT 1999 | Stu Leech
We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale board
Electronics Forum | Wed Aug 18 22:02:24 EDT 1999 | Stu Leech
| We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale boa
Electronics Forum | Wed Aug 18 22:21:26 EDT 1999 | Dave F
| | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale b
Electronics Forum | Thu Aug 19 05:42:01 EDT 1999 | Brian
| We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale boa
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