Electronics Forum: standards (Page 216 of 360)

Xray - Site Environmental & Safety Requirements

Electronics Forum | Wed Nov 19 09:44:09 EST 2008 | stepheniii

In Ontario it's "safety code 32". We have a radiation survey done at least once a year. To have the manufacturer do it, we have to pay air fare both ways and a hotel. After much searching I found someone local that does them. I ended up finding him

Xray - Site Environmental & Safety Requirements

Electronics Forum | Wed Nov 19 20:24:15 EST 2008 | davef

There are a number design safety standards for X-ray inspection systems, such as ANS N537 and CFR21. Further, each state will have it's own version of these regulations. We agree with Jerry's post that suggests that your equipment supplier is the b

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 13:16:54 EST 2008 | sjpence

Simon, The equivalence factors were used to scale the values measured by ionic testing equipment to the values measured in the standard manual method. There is a good write-up by Bill Kenyon in this Technet Post describing the creating of the facto

AOI Inspection equipment for populated PCB's

Electronics Forum | Wed Dec 17 07:43:44 EST 2008 | muarty

I have just carried out an evaluation project including Mirtec, MVP, Landrex and Viscom. If you are interested in my findings you can contact me offline. In short though, we found that each had plus points to them. If you could join together the outs

ENIG

Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70

Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de

Conformal Coating Query

Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef

Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P

AOI False calls

Electronics Forum | Thu Mar 19 08:12:11 EDT 2009 | stepheniii

Some digital cameras absorb IR light that is invisible to us. It's standard for digital cameras to put an IR filter in front of the CCD. Maybe your machine doesn't have such a filter for it's CCD or it isn't 100% effective. I will have to ask out

BGA re-balling yields

Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111

We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After

Question of delamination in PCB

Electronics Forum | Thu May 07 19:29:40 EDT 2009 | kareal

Hi Davef, Do you means it is natural for tin diffusion to copper trace during SMT process? but I could not detect tin in UHAST T=0 unit, and the tin diffusion was found only in copper trace of C4 cage. Two question: 1) Could you tell me which pr

conformal coating - masking problem with ammonia

Electronics Forum | Tue May 12 06:44:16 EDT 2009 | jhk71

We do a conformal coating for a customer with copper-nickel-gold pads on his board. The pads are masked prior to coating with a standard gel, containing ammonia. After thousands of boards, being processed like this, now the gold pads seem to be less


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