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Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Sat Jan 22 20:59:51 EST 2000 | Jeff Sanchez
Michael, I am not sure if you are trying to lay out a board with vias in the pads or suffer through an assembly you got stuck with? I am building run of boards right now that has vias in most the smt pads. I'm sure the design group thought it was
Electronics Forum | Fri Dec 10 08:44:52 EST 1999 | Dave F
Vinesh: You�ll find no papers that "clearly describes the harmful effects" of your style "of white residues," because no one is crazy enough to brag that they are doing what your customer wants you to do. The residue of no-clean fluxes are designe
Electronics Forum | Sat Sep 11 13:44:48 EDT 1999 | Dean
| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h
Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup
| | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | Going through datasheets wasn�t that helpfull, so does anyone know of a source for
Electronics Forum | Tue Aug 31 19:16:59 EDT 1999 | Steve Surtees
| I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ram
Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
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