Electronics Forum | Thu Jun 18 14:46:38 EDT 1998 | Igmar Grewar
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Fri Jun 12 13:47:20 EDT 1998 | Enza Hill
The SMTA Great Lakes Chapter (Chicago area) is holding a Rework Symposium on June 30th. (I know REWORK is a dirty job, but some of us have to do it!) We will have several speakers in the morning on the following topics: - Rework Management & Optimi
Electronics Forum | Sun Jun 07 19:09:21 EDT 1998 | Graham Naisbitt
Chiakl Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it will b
Electronics Forum | Sat Jun 06 15:39:53 EDT 1998 | andy jones
I am the UK sales manager for Europlacer and therefore biased. However our Europlacer range would be perfectly suited to your application. We supply as standard intelligent feeders so barcoding etc is no problem. please contact me on my e-mail addre
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Tue May 12 04:15:48 EDT 1998 | Chris Sargent
Help! We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The pro
Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Sat Apr 25 12:58:13 EDT 1998 | Earl Moon
| Is there an industry standard in calculating SMT process | PPM level for benchmarking purpose ? What are the industry | benchmark ppm number for some of the defects like solder | short for 20-mil QFP, tomstone problem for 0603 components etc....
Electronics Forum | Fri Apr 24 20:33:06 EDT 1998 | D.Lange
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
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