Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
Electronics Forum | Wed Jan 12 05:36:37 EST 2011 | vinitverma
We designed a fairly simple software called PROCAM to do exactly that! It takes 2 Gerber layers - Paste/Mask layer and the Silk layer. Within minutes you can extract all the centroids. PROCAM has a standard excel output with all the centroids, fiduci
Electronics Forum | Fri Dec 17 00:55:22 EST 2010 | kemasta
Hi Kim Dun take any risk in delamination bcoz u > will be the person to answer for being it. So, > we do bake all Pcbs, which have 3months of shelf > life, b4 startin any process although they are > still inside the factory packs. We keep it in
Electronics Forum | Thu Jan 20 23:59:30 EST 2011 | jeffr
These machines have three heads... Head 1 (jaws 0.7mm x 4mm)0603 up to small tantalum. Head 2 (jaws 3.0mm x 20mm)small tant up to PLCC44 or SOP28. Head 3 No jaws, uses just Vision. Can do Large tantalum up to QFP208, however can only take a single no
Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson
You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented
Electronics Forum | Thu Feb 24 22:32:56 EST 2011 | rstadem
PKannan, Your opinion is contrary to J-STD-005 "Requirements for Soldering Paste". Within that document is included specific requirements for re-certification of expired solder paste. Paste that is expired can be used after a simple viscosity test an
Electronics Forum | Fri Apr 08 10:48:58 EDT 2011 | billmeye
We have Mydata and you can print a report telling you the average placement time per part number. I monitored a few months of jobs, broke things into package type, grouped packages with similiar times (such as chip components up to 1206, SO-8,14,16
Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer
We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta
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