Electronics Forum | Wed Dec 08 04:19:16 EST 1999 | pascal MATHIEU
I am working in electronic automotive industry and today we are facing to a very serious problem : if we want to use a PCBoard with a copper thickness of 90�m + fine pitch circuit (0.65mm, 0.5mm) the supplier(several) of the PCB has some trouble t
Electronics Forum | Wed Sep 18 18:48:33 EDT 2002 | davef
Fabs can produce a solder mask web between 20 pitch leads, but I've never seen a web for 16 pitch leads. Although, I would like know a supplier that can lay-down a fine web. Minimum solder mask web width is about 0.004 thou. An absolute mininum o
Electronics Forum | Tue Jan 14 11:02:59 EST 2003 | soupatech
I found a feeder with a 2mm pitch and was told that although it was made for the CP4, it would work with the CP3. Before we throw out a thousand bucks, has anyone had experience loading parts off of a 2mm pitch tape with the CP3? The part is a 1.6
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M
I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5
Electronics Forum | Thu Sep 19 12:08:39 EDT 2002 | ccross
I would like to thank everyone for their time and replies
Electronics Forum | Tue Sep 17 15:03:33 EDT 2002 | ccross
I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the re
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
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