Electronics Forum: statistical process control (Page 1 of 152)

Quality control

Electronics Forum | Mon Aug 27 16:13:35 EDT 2001 | seand

Hello Everyone, For QC purposes, there are a couple of methods to both qaulitatively and quantitatively inspect your manufacturing process. For Paste inspcetion, an inline machine like the SE300 by CyberOptics may be appropriate. You may also inco

SMT control management software

Electronics Forum | Mon Jun 29 06:57:13 EDT 2015 | jlawson

Valor MSS has options for NPI Data preparation and processing, SMT programming, documentation, verification, materials management, traceability, and QA management not just in SMT but into backend process aka manual assembly as well as production plan

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish

how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile

how to control warpage on panelized pcb during reflow process

Electronics Forum | Thu May 23 10:21:19 EDT 2019 | emeto

What is the material of this PCB?

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon Jul 01 04:39:49 EDT 2019 | sssamw

yes, You need tell us how the PCB and board designed, size, material, how de-paneling the PCB?

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz

You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629

if use tray cannot solve the problem, you can change from the design 1)Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel

if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

Quality control in manufacturing

Electronics Forum | Fri Sep 02 19:31:40 EDT 2011 | jlawson

I agree that if information is processed correctly up front in process down stream QA becomes less expensive ie AOI etc as AOI at end of lines is telling you you have made mistakes in up stream. I better to eliminate mistakes or have process to avoid

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