Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Thu May 23 10:21:19 EDT 2019 | emeto
What is the material of this PCB?
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Mon Jul 01 04:39:49 EDT 2019 | sssamw
yes, You need tell us how the PCB and board designed, size, material, how de-paneling the PCB?
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1）Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon
| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any
Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
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