"std" search results in the Electronics Forums

799 results found for "std" in the Electronics Forums

Order by: Relevancy |   Date


Sep 24, 2019 | IPC-J-STD-003C: Solderability Tests for Printed Boards [

Assembleon / Philips / Yamaha VIOS - PCB copying

May 21, 2019 | UFOS -> VIOS 2.13 std (2 files - *.brd and *.fdr).

Requirements for a room with SMT equipment

Sep 20, 2017 | Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001

Humidity and temperature

Sep 15, 2016 | J-STD-001 Revision F with Amendment 1

Solderability test - OSP

Feb 11, 2016 | Try: * J-STD-003 “Solderability Tests for Printed Boards” * IPC-4555 OSP Finish Specification

PCB pads corrosion

Dec 15, 2015 | Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests

Solderability problems with gold plated PCB's

Nov 12, 2015 | IPC J-STD-003. Solderability Tests for Printed Boards

Key Points to be considered while buying Ionic Contamination Tester

Nov 2, 2015 | An ionic contamination tester should meet industrial cleanliness specifications including MIL-STD-20

IPC J-STD-001E Ionic Cleanliness Standard

Aug 30, 2013 | IPC-J-STD-001E in regards to Ionic Cleanliness standards states less than 1.56 µg/cm² of total NaCL.

J-STD-001E Section 4.3 Solderability

Dec 14, 2011 | Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-0

Flux evaluation

Dec 29, 2010 | Flux evaluation * J-STD-004, Requirements for Soldering Fluxes * IPC-A-610, Acceptability of Elect

Conformal Coating Strip with Connectors???

Jan 26, 2010 | Are there any MIL-Std approved methods of striping conformal coating without removing connectors?

Solder Wire Expiry Dates

Sep 9, 2009 | Hi Dave, J-STD-005 is the standard for solder paste requirements. I checked J-STD-006 for solder

Conformal Coat peeling

Apr 9, 2009 |

CCGA solderability criteria

Jun 19, 2008 | Try: ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wir

SMTnet featured article

Jan 4, 2008 |

PWAs & PWB bake out requirements

Aug 9, 2007 | DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bak

J-STD-001 Par 4.2.2 Temperature and Humidity

Jul 16, 2007 | J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only tha

Reflow issue with QFN

Jul 5, 2007 | ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires


Jun 20, 2007 | J-STD-001, 5.4 Solderability Maintenance states words to the effect "The manufacturer shall ensure t

Solder Joint

Jan 30, 2007 | Sad part is THEY specified IPC J-STD-001C!!!

SAC305 constituent percentages

Jan 17, 2007 | I think you might be looking for J-STD-006. Here is a link to the table of contents: http://www.dy

SMT Production Floor RH Control

Jan 10, 2007 | ANSI-J-STD-001: 18-30*C, 30-70%RH

Baking of MSD devices

Nov 29, 2006 | According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22


Sep 25, 2006 | 1000 Lumen per meter squared minimum per J-Std-001D 4.2.3

Lead Free boards

Sep 6, 2006 |

Soder Paste Testing

Aug 30, 2006 |

Questions on J-STD-033A procedure (Table 4-1)

Apr 21, 2006 | I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to

Humidity in SMT room

Feb 17, 2006 | ANSI-J-STD-001 says words to the effect: 18-30*C, 30-70%RH

Precision Auger Dispense Pump

Led testing color sensors