Electronics Forum | Tue Dec 11 12:29:57 EST 2012 | deanm
Thanks for the comments so far. The smallest nozzle I've tried is a 4mm, which is what Pillarhouse used on this board to provide a sample. I tried this but wasn't as good as the 6mm. I've soldered the same connectors on a different board using a 10mm
Electronics Forum | Thu May 02 15:29:19 EDT 2013 | jim_n_hky
I can't answer your specific question on the floor, but I have some suggestions. The equipment manufacturer should be able to provide the floor loading requirements. A structural engineer should be able to translate that into specs for hte constructi
Electronics Forum | Thu Oct 17 17:29:46 EDT 2013 | lordofpiggies
Hello. We are building a CCA which has a silicone-based adhesive whose purpose is to bond the bottoms of multiple LED displays to heat sinks. Our customer wants the CCA to be tested for ionic residues per J-STD-001, but we are hesitant to test the
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm
Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid
Electronics Forum | Mon Feb 25 09:53:30 EST 2019 | tombstonesmt
Good morning! In order to comply with current IPC J-STD-001G Appendix A-2, I'm putting together a log to periodically monitor solder tip temp tolerance, tip resistance, voltage leakage, etc.. I'm solely focusing on the hand solder stations for the t
Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef
No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
