std

"std" search results in the Electronics Forums



799 results found for "std" in the Electronics Forums

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Type 4 powder

Jul 25, 2019 | In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager,

5% color spot in HIC

Jul 16, 2012 |

Soder Paste Shelf life extension

Feb 25, 2011 | Dstadem, Thanks for bringing your in valuable experience with the J STD 005 " Requirements of So

Yestech AOI question

Oct 29, 2010 |

Pb Drying / Degassing PWB

Nov 22, 2008 | IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comp

COB and Plating

Oct 7, 2008 |

Conformal Coat Thickness

Jul 23, 2007 | NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons proc

Plating Rework

Dec 26, 2006 |

"Gap" in completed solder joint between lead and pad

Nov 30, 2006 | Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001

Dry Box Storage

Jan 19, 2006 |

Identify A No-Lead Part

Jul 19, 2005 |

Dewetting on QFP

Jun 7, 2005 |

Cleaning of PCBA's

Apr 14, 2005 |

Ionograph or Omegameter

Nov 1, 2004 |

BGA ball and PCB pad

Feb 17, 2004 |

MSD Rebaking Guidelines

Jul 11, 2003 |

BGA Rework

May 8, 2003 |

Skewed transistors

Apr 18, 2003 |

Making a BGA stand up

Jan 16, 2003 |

Flux Conductivity

Aug 13, 2002 |

PCB baking for rework

Jul 17, 2002 | The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycl

Sn/Pb diffusion

May 3, 2002 |

Any comments for Quality @ AQL=0.1, C=0 ???

Mar 25, 2002 | ASQC re-numbered the once free (taxpayer sponsored development) MIL-STD-105 as ASQ-Z1.4, slapped the

BGA,s Storage

Nov 7, 2001 |

Micro BGA baking

Aug 13, 2001 |

No clean flux residue

Jun 1, 2001 |

Part sliding in reflow?

Apr 17, 2001 | Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL co

Need Expert Support

Mar 14, 2001 |

Solder Pot Temperature

Feb 5, 2001 | Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C).

Flexible high speed pick & Place

Non-heated dispensing system