Electronics Forum: stencil and design (Page 46 of 167)

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

CIM systems and Final Assembly

Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp

CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly

Desiccants and pcb finish degradation?

Electronics Forum | Wed May 16 08:48:12 EDT 2001 | ohboy

I been a bunch o' places...! Some good, some bad, re-inventing the wheel in many cases. Our specs are pretty specific in a lot of cases, but that doesn't mean they always get followed. It usually becomes a case of "It's not quite right, but we rea

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Attention Equipment Sellers and Buyers

Electronics Forum | Tue May 05 08:57:14 EDT 1998 | Cunli Jia @ SMTnet

Everyone, The PCB Capital Equipment Mart has been open to the public since Monday, May 4. This new service was designed for you, the equipment vendors and users, with input from some of you. All of you can post free ads of quipment for sale or wa

New Pick and Place Operation

Electronics Forum | Wed Jun 02 15:46:08 EDT 2004 | drlou

I have been reading the forum to try and figure out what brands to look at for Pick and Place machines. We need around 3,600 cph, and would like to be able to handle 0402, soic, tssop, and perhaps as little as 0.020" pitch. Max pcb is 9 x 13". Looks

New Pick and Place Operation

Electronics Forum | Tue Jan 17 10:59:43 EST 2006 | Rob

Hi Pete, Thanks for taking the time to respond. My experiences with Mydata would differ from yours, but as in life, different machines are for different circumstances. We have many low volume customers that love them - they are easy to use, upgr

tape splicing pros and cons

Electronics Forum | Fri Sep 23 10:25:40 EDT 2005 | gregp

On our machines, the feeder release latch is designed such that the feeder goes offline (machine will not pick from it) before you can actually remove the feeder. This makes it virtually impossible to damage a nozzle or spindle. I'm not sure about

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 12:41:48 EDT 2015 | deanm

I chose a Vitronics XPM3i primarily for the AutoSet automatic profile generation feature. We are high mix and simply cannot profile every board. The AutoSet feature is quick, easy and we rely on it 100% and have great results. These ovens have had ve

Merging BoM and XY Data

Electronics Forum | Tue Mar 19 11:31:02 EDT 2019 | bruce_mackean

Hi there. Sorry I haven't responded sooner. The video I posted was a very preliminary trial that I developed as an option to my BoMCompare application. BoMCompare is a tool that can compare Bills or Materials of various file formats (xlsx, csv, txt,


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