Electronics Forum: stencil and design (Page 6 of 167)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

Re: No Clean stencil design

Electronics Forum | Mon May 15 19:59:45 EDT 2000 | Dave F

Doug: If the metal content of your NC paste is about 50% (by weight) there is no difference netween stencils for NC and other flux type pastes. And those are in the SMTnet archives. Good luck and happy searching Dave F

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 23 12:33:37 EDT 2019 | ameenullakhan

Hi , Its CCGA part . with normal PCB pad opening similar to other BGA pad . Yes its very surprising and we are not able to analyze. What exactly went wrong. We have new stencil design for this now. Will run it tomorrow. Will update the results.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:28:47 EDT 2019 | ameenullakhan

Your inputs are always valuable and help a lot. Thanks for the inputs.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 09:50:51 EDT 2019 | ameenullakhan

Attached is the image of lead lift in ccga

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan

Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:47:56 EDT 2019 | davef

Ameen: Send me your email address by selecting the link under my avatar to the left. Thanks.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an


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