Electronics Forum: stencil aperture (Page 56 of 121)

LGa soldering issues......

Electronics Forum | Thu Aug 06 16:32:38 EDT 2009 | markhoch

Yeah, those gosh darn disty parts...get you every time. lol Can we get just a little more info? Let's start with the basics... Stencil Thickness? Aperture Reduction? Leaded or Lead-Free? No-Clean or Water Soluble? How's your reflow? Have you prof

Reliability of U-shape appetures

Electronics Forum | Fri Jul 05 11:45:47 EDT 2002 | stefwitt

I have seen the U-shaped aperture on a customer site, being used with success. However, the problems with the stencil and the �loose� tabs where reportedly a reason to search for different aperture designs. Before this company could test their ideas

Re: Stencil Opening

Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach

| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 15:30:17 EST 2001 | dason_c

Please check what is the actual pitch size. I found some of the designer use 15.7 mil pitch and no accumulate ie 15.7, 15.7 and 15.8...... Also, I recommended the pad width should be 10 - 11 mil for 0.4mm pitch. You can open the 10 - 10.5 mil aper

Dry solder

Electronics Forum | Wed Feb 15 01:49:34 EST 2017 | soldertraining

Hi I completely agree with you. Also, the Dry Solder paste can be used in wireless repair operations such as the repair of smart phones, tablets, laptops and other handheld devices. The lead-free solder paste can be squeegeed through the apertures of

0201 printing

Electronics Forum | Tue May 02 07:50:41 EDT 2023 | wippsen

Hello, who is printing 0201 apertures or smaller and can provide information on stencil design, stencil thickness and type of solder paste?

Adhesive Application by Stencil

Electronics Forum | Thu Mar 22 16:52:10 EST 2001 | kaopsahl

Yes, there are adhesives designed just for stencil application. Usually plastic squeegee blades are recommended for best printing results. Plastic stencils are also available for this application. Both Alpha Metals and Loctite have articles on this s

solder paste height standard

Electronics Forum | Wed Jan 08 08:20:52 EST 2014 | emeto

To most of our boards I give 20-30% tolerance in both directions. From experience if you have big aperture on your stencil, the squeegee will scoop certain amount of paste from this aperture and you will see lower height. Depending on your board supp

Re: Pin-To-Paste

Electronics Forum | Wed Oct 07 15:15:04 EDT 1998 | Joe P.

| I am currently experimenting with Pin-To-Paste reflow. does anyone know some excellent references or links that could give me tips and tricks, optimal aperature dimensions, etc. I have been informed that if I have pull through that I should put a

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef

You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo


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