Electronics Forum: stencil cleaning (Page 101 of 114)

Cleaning Paste from 2nd Side Print

Electronics Forum | Wed Nov 01 11:30:49 EST 2006 | slthomas

Dave, your points certainly have merit and I wouldn't make a habit out of that method. We did it only because there were a lot of parts dependant upon chipbonder and we didn't think they'd all survive an ultrasonic cleaning, functionally or physicall

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow

It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

Re: I'm baaack!

Electronics Forum | Wed Apr 21 13:52:34 EDT 1999 | Steve Gregory

Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dry,

Re: I'm baaack!

Electronics Forum | Wed Apr 21 18:58:44 EDT 1999 | Earl Moon

Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dr

Re: uBGA's

Electronics Forum | Tue May 18 16:22:43 EDT 1999 | Earl Moon

Hi Guys, I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? So, any of you folks who

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone

Re: Where can I purchase a PCB with a bare copper grid for solder flux evaluations.

Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F

I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS

Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup

My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks We use 6 mil lasercu


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