stencil cleaning

"stencil cleaning" search results in the Electronics Forums

9777 result s found for "stencil cleaning" in the Electronics Forums

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Solder Joint Discolouration

Jan 4, 2019 | Hi, Here we take profile for every changeover. And we compare it with our profile.For the oven performance. We daily take a minimum of 3 profile for one oven. We have High mix low volume production. We are using ORH1 ( organic flux with halid content ). We once had a cleaning issue of the flux , which in turn corroded the board. At customer end. Lab report of PCBA showed there was chlorine content , which was not cleaned properly. So now also we were analyzing our cleaning efficiency. Regards, Ameen

Need help on buying part for IEMME ITALIA Hydra 1662 Wash Machine.

Sep 25, 2018 | ="_blank"> Kolb can be found here sarason

Auto cleaning squeegee

Aug 17, 2017 | Auto cleaning squeegee Dear experience members, Now we are using permelex squeegee blade and we do cleaing it after printing 24 hours. Actually, it took very long time to clean. we need to take out one by one screw and use bemcot paper/ alcohol to clean solder remaining on blade and holder. Now we are thinking to use

Wave soldering defects

Dec 28, 2016 | Dear Anshang38, I actually don't have a profiler in order to get a new profile. I adjusted the machine once a coulpe years ago and did all regular maintenance and cleaning and it kept working fine until some weeks ago. I've changed all the flux and cleaned up the system, pipes and spray. I 've removed the dross and cleaned the pumps removing residues. I've also checked the temperatures with external devices just to be sure the readings from the machine are correct. The one thing I didn't do is changing the solder bath. Thanks!

Batch cleaner not getting PCBs clean and dry

Dec 9, 2016 | Batch cleaner not getting PCBs clean and dry Hi Dean, We are a manufacturer of cleaning equipment. I'm not sure if your machine is one of ours or another brand. Regardless, I am happy to provide assistance. In order to maximize the level of "helpfulness", it would be helpful for me to know more details about your process. Things like flux type, specific chemical additive, chemical concentration, and recipe parameters. Please feel free to contact me directly at and we can geek-out on cleaning :-) Mike Konrad President Aqueous Technologies

Clearance between Through hole and chip component

Feb 28, 2007 | Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem without redesigning your board or twisting up

Stencil Fiducials

Feb 16, 2007 | Stencil Fiducials we use A EKRA X5 it can use A pad our the fiducial I generaly use A pab becuse most of our stencil don't come with the fiducials on them and our boards our HASAL and the fids our domed most of the time the smt pads work better for me

RoHS BGA stencil question

Feb 8, 2007 | RoHS BGA stencil question Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IPC-7525. Paste will release. BR, Pavel

Printing off contact

Feb 7, 2007 | mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20 on the stencil will work... and it doesn

Pump Stencil

Jan 19, 2007 | Pump Stencil Hi, We have at DEK printed paste through a Pumprint stencil onto clinched leads, but there will be limitations depending on the product. If you can send a sample loaded board to me indicating where you want paste deposits then I can certainly take a look and let you know if it is do-able. Email me

Solder paste handing

Jan 16, 2007 | Then how do we explain the poor printing performance (appears to be rheology based, paste thickening/drying, poor aperture fill, sticking to the blades, etc.) of paste that has exceeded it's shelf life? You know, the stuff that no amount of stirring prior to dispensing on to the stencil or working once on the stencil can fix. My impression has always been that it's lost some/all of the volatiles (thinning agents?) in the flux.

Tooling and Stencil Design

Dec 16, 2006 | Tooling and Stencil Design Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefore able to work when perhaps you guys are sleeping

UBLOX Tim-4A reflow problem

Dec 11, 2006 | Hi, We use UBLOX-LEA-LA. Is this the same component as you are using? We followed the recommended stencil design with a 6thou stencil and we have had no issues. We have run approx: 3k units so far. We had some minor issues at the start but this was down to the profile. aj...

Stencil foils delaminating

Nov 11, 2006 | Stencil foils delaminating and was mixing concentrte directly into the bath. The stencils would delaminate in 5 minutes. Needed 6:1 water to chemistry. Oops!

Always a new treat with new clients

Oct 4, 2006 | IIT (Integrated Ideas and Technology) could cut you a mini-stencil for about $150 and have it for you the next day if you have the gerbers. Otherwise, they can scan a bare board and create a stencil from that. I've had excellent service from them and they are fast.

Midchip solderballs (MCSB) on pb-free

Sep 26, 2006 | me and my big mouth. we are currently running a leadfree product and I am getting MCSB on all 1210 caps. Using homeplate with 10% reduction 6thou stencil. I contacted my stencil supplier to ask for advice- they are looking into it but he did mention that they have been asked to go 1:1 from other

Stencil Cleaner

Aug 14, 2006 | Stencil Cleaner Hi All, I am trying to source a second hand stencil cleaner. I have come across a Systronic 172 and a Systronic 152. I am unable to find the Systronic website, can anyone who uses either or let me know what they think of them. Thanks, Alan...

SAC305 Solder Balling

Aug 4, 2006 | Hi, Have you incorporated any Aperture Modifications in your stencil.( i.e. Homebase / 10% reductions). I have a similiar problem here with one of our high volume builds and I am in the process of ordering a new stencil with recommeded aperture reductions / modifications. I am confident

Imm Silver & Screen Printing

Jul 31, 2006 | Hi Russ, Wow, just Chempolished ah? These stencils are electropolished, so I would think they would release pretty easy. Ours are 6 mils, ut I don't think that would make a big deal though. I'm talking a nite and day diff between jobs. I guess a direct comparison between stencil mfgers

Imm Silver & Screen Printing

Jul 31, 2006 | Hi Steve, Yeah outta my control, till NPI tosses it over the wall. Yes, everything was kept the same but we did go to a new stencil house. I'll try an ego busting move and ask if we can order a stencil from were we normally do if/when we respin the board (bat the eyes, show the rack, shake

Stencil cleaners.

Jul 25, 2006 | Stencil cleaners. Here is an excellent technical explanation of stencil cleaners and their differences (spray, ultrasonic, chemistry type) that I found in the archives: http://www

Solder paste volume require.

Jun 1, 2006 | Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and telling them that stencil thickness need to change.

fine pitch printing

May 17, 2006 | I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and different angle squeegee's. I still cannot get a consistant print (voids). Please help!!-----Pitch is .017" and stencil thickness is 8mil.

SMT line validation

Feb 22, 2006 | We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For example how can I validate a stencil printer? Maybe

poor print definition

Feb 20, 2006 | Hallo all, I have recently had possibility to work with DEK265. I have met with problem poor print definition (no sharp edges). I used stencil 150 thickness, metal squuegees. I moved than the same stencil, squeegee and parameters to DEK nifinty and the print was very good. What can be the problem

Solder Paste Problem (M705)

Dec 16, 2005 | How about keeping a fridge near the line and only putting on the stencil what is needed, then topping up from the jar as & when? As soon as the paste hits the stencil flux will evapourate, and all of that time spent by people in labs developing complex multi-stage fluxes will be wasted. So leave

Fine Pitch Stencil Design

Dec 8, 2005 | Fine Pitch Stencil Design Any good stencil house should be able to recommend the proper configuration on a fine pitch aperture design. They can also advise you as to which foil thickness works best. The norm foil thickness is .005" - .006". There are always special instances where the norm may not apply. IE: The area

BGA Reballing

Dec 8, 2005 | Go to and look up the rb-2000. There is a step by step discription of how to do it and as mentioned before you will need a thicker stencil for your application. there will me a list of stencil

Need Help for CCGA Rework

Nov 11, 2005 | We use at least an 8mil thick stencil for these parts. The Columns do not collapse or reflow so you need to ensure plenty of solder volume for reliable attach and to make up for the coplanarity of the component itself. I assume we are not really talking about a .64mm stencil .024" thick (no

smt machines function

Oct 20, 2005 | there are various SMT machines 1. Stencil Printer 2. Pick and Place machine 3. Reflow ovens 4. Automatic optical Inspection machines start with visitng Stencil printer websites like MPM, DEK etc. Pick and Place -- Univesal instruments, Mydata, Fuji etc., reflow ovens -- Heller, vitrionics etc. AOI

Water Jet Stencil Cut

Oct 3, 2005 | Water Jet Stencil Cut equipment. Now days laser cutting of masks and stencils is a very common practice and produces good results. Why would you want to use water jet anyway?

Using Glue on Stencils What aperatures to use?

Sep 16, 2005 | Using Glue on Stencils What aperatures to use? We current use glue on our bottom side boards using stencils and screen printers. Our Glue aperatures that we use are very small rectangles and they seem to clog very easily. We currently are using Heraeus PD955PR #8 and see alot of boards that are not getting alot of glue because

Tombstone caused by flux residue

Jul 25, 2005 | Folks thanks for all the info, I'm gonna check out our pad geometries and see how they compare with industry standards. Brian, could you elaborate a bit more on the stencil design you have mentioned. Do you mean that you have offset the stencil apertures so the print is slightly off the pads

Mosfet stencil design

Jul 18, 2005 | Mosfet stencil design I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming underneath the part. Am currently using a 5 mils with a window design for my stencil. Those anyone have experience or have any suggestion for an aperture that will eliminate solderball. thanks Sylvain

Lead Free Stencil Design

Jul 13, 2005 | Lead Free Stencil Design I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on reducing MCSB's while not increaseing tombstoning

Lead Free Stencil Design

Jul 13, 2005 | Lead Free Stencil Design The reason for going 1:1 with lead free is that it does not spread out like the pb solders. So 1:1 is really not necessary in my opinion. We go 1:1 anyway on discrete components along with other packages. You always have to make sure that the area and/or aspect ratio is acceptable for stencil

shut down for storms

May 11, 2005 | Hmm..that gets me thinking. How about lightning rods for SMT equuipment. Actual conversation of customer on plant tour: Customer: "What the hell is that? Is that a 30 foot tall signal tower on that stencil printer?" No. That's our new speedline lightening arrestor. This priner model has programmable 2D/3D inspection, automatic stencil wiper and we can handle upto a 900 megawatt lightening strike!

UP1500 Frame Sizes?

May 2, 2005 | I forgot to mention one key detail. This goes against the typical thought process when confronted with the above mentioned dilemma. The stencil depth/size must remain at 29". You must lie to the machine and pretend to have a 29" stencil with a 5" frame. Give it a shot, I have seen it in action more

Screen printing Solder Mask

Mar 7, 2005 | Russ, I tried to get a screen for glue but the design engineer who laid this board out made up his own rules. The 0402 pads are to close for a proper dot size.....per the stencil house. That is why I am going the solder mask route. I would rather stencil the glue.

Solder paste height checking

Feb 18, 2005 | Hi Everybody, Mostly customer asked about the solder paste height checking after printing process.Is it compulsory to check the height if we are using stainless steel stencil and metal blades in fully automatic printer.Any technical answer to their question other than that we r using SS stencil

BGA question

Feb 9, 2005 | First off how thick is your stencil going to be? I have printed .5mm pitch with .009" apertures with a 6 mil stencil. A 5 mil would have been better but the 6 worked just fine. Pitch is not necessarily the deciding factor for paste type. it is the aperture opening that determines what mesh you

Stencil Tension

Oct 25, 2004 | Stencil Tension Davef, Thank you for your reply.You are right that I need to consider the tickness also of the stencil. Previously, I take for granted this process of measuring the tension and I usually let my technician do that. However, I have to determine the practicality of the limits. I thought we have a

BGA/Fine pitch footprints

Mar 2, 2004 | I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way they are still there if you need them. This shouldn

MPM3000 vs 3050

Dec 6, 2003 | 3000 base model 3010 adds feature 3020 adds features 3030 adds features 3040 adds features of the line Sorry I don't have the feature list. It's things like Environmental control unit, under stencil wiper, stencil exchanger, 2d inspection, 3d inspection....that nature. Good

Blocking stencil apertures (on purpose)

May 1, 2003 | Blocking stencil apertures (on purpose) If Kapton tape doesn't work, I would recommend eating a few hundred bucks and ordering a new stencil. I think your asking for more trouble trying to plug the apertures with dried paste, glue, or anything else. It will dislodge sooner or later and probably just cause other printing problems.

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Mar 6, 2003 | What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended Printer settings - pressures & speeds, or any

0402 stencil design

Feb 5, 2003 | 0402 stencil design I figure if you need the rest, you don't need these. These strips are from some laser cutting tool fabricator. They give them to their customers [laser cut stencil fabricators] so the customer can do a good job. Yall have a nice day now, y'hear?

Stencil Printing Experiment without AOI

Jan 8, 2003 | Stencil Printing Experiment without AOI of the stencil, increasing the mess and adding to the underwipe requirement.

Fine pitch paste release problems.

Dec 18, 2002 | I dont know what kind of screener you use but my 1st impression is that the board and stencil are separating too fast,the paste doesn't have enough surface tension to stay on the board, you're tearing the paste off the board. If you can, slow down the separation speed between stencil and board

Fine pitch paste release problems.

Dec 16, 2002 | Hi, Yes, the stencil does touch the PCB. Is there another method? Sorry to sound a bit dumb on that, however I don't have a lot of experience with automated stencil printing, and manual has been working well up to now with this BGA. Regards, Grant Petty Blackmagic Design

Defluxing Advanced Packages

Fluid Dispense Pump Integration