stencil cleaning

"stencil cleaning" search results in the Electronics Forums

9814 result s found for "stencil cleaning" in the Electronics Forums

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Poor soldering on fine pitch?

Jun 9, 2006 | did you look at the pad vs the stencil design? are you putting down enough solder paste on the pads? what are your reduction ratios for these packages?

Solder paste volume require.

Jun 6, 2006 | Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.

Solder paste volume require.

Jun 2, 2006 | Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.

fine pitch printing

May 18, 2006 | Go 5 or 6 mil thick with stencil, i am not familiar with that pitch but I would recoomnd a 5mil. Was the thickness in this post before and i missed it? Russ

Tooling for printers

May 10, 2006 | Hi everyone, I am trying to evaluate the cost of buying new equipment. One of the concerns is blade holders, stencil frames and board vacuum tooling. How difficult is to change from Dek to MPM or viceversa without changing all our tooling.

Standard for Stencil printers edges pressure

Apr 19, 2006 | Well, that would make more sense!!! Do you not have a manual for your printer? Contact the MFGr.

Standard for Stencil printers edges pressure

Apr 19, 2006 | Really, you have been a great crowd!! Don't forget to tip your waitress.

Standard for Stencil printers edges pressure

Apr 19, 2006 | "We use depleted uranium blades." He'll be here all week, folks. Try the veal!


Apr 6, 2006 | Hello Dougs: Have you tried stenciling solder paste to the BGA part itself. You will find this most helpful for your heat transfer and attachment integrity of the component in a Pb free process.

Stencil design question.(BGA Apertures)

Apr 4, 2006 | I did the apertures 1:1 using an Invar foil material. I will post and let you know how it works o

Stencil design question.(BGA Apertures)

Apr 4, 2006 | I have used a .013" square under these conditions. Limited run but all were good. 72 qty in 1 ba

Stencil design question.(BGA Apertures)

Apr 3, 2006 | I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I ne

Air inclusion in solder paste

Mar 27, 2006 | Mike The air 'contained' in the aperture would prefer to escape between the board and the bottom of the stencil rather than through your paste while you're printing over it.

Heat Sink for QFP

Mar 24, 2006 | Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern? Thanks, Mike.

Via holes and Wave Solder

Mar 13, 2006 | "Surely this is a job for Wavemaster Larry?" I know this is supposed to be a serious forum, but that's some funny stuff! 8 mil stencils. Suuuuure.

Stencil thickness

Mar 13, 2006 | 0.2mm gap between parts is small and easy to solder short. I prefer 5mils or 4mils.

LLP Device

Mar 9, 2006 | one point to remember is to have a large stencil reduction on the thermal pad, you need to reduce the solder volume by about 35%, if you don't you risk the solder from the thermal pad shorting out the other leads or the solder volume causing the component to lift slightly causing open circuit.

BGA Reballing companies?

Mar 3, 2006 | Try Mini Micro Stencil. They have been doing it longer than anyone out there with the best reputation for quality and turnaound time. Contact David at 760-591-3804. You will not be disapointed.

Stencil thickness

Mar 2, 2006 | Dis agree?!?!?! We solder plenty of them o6o3s at honda and they l00k 0k! Solder balls will always

Stencil thickness

Mar 2, 2006 | WELL, I heer that thikness was always wrong where I work, and for what ever reason the engineering d

Stencil apertures IPC design

Feb 28, 2006 | The key driver to aperture design is to assure a fillet of the proper height for the component temin

stepped stencils

Feb 23, 2006 | Depends what is adjacent to the step. 1206 chips could reside closer than say a 16 mil fine pitc

Stencil and board Ultrasonic cleaner

Feb 1, 2006 | Maybe at dat homie�s shop, they opted ta use Semco ridetridges instead of jars, and they didn�t gots

Stencil and board Ultrasonic cleaner

Feb 1, 2006 | I would recopmmend contacting Aqueous technologies or Smart Sonic along with other Mfgrs. They will

Tomb-Stoning. What's going on here?

Jan 18, 2006 | Hi Bjorn, Yes that can also add to tombstoning, but if maticulate your stencil to a high sanalot, you shouldn't see any tombstoing.

Problems with space space saver stencils

Jan 3, 2006 | I agree - beware of the cheap imitations. To date, I have had very good experience with the VectorG

Fine Pitch Stencil Design

Dec 14, 2005 | Way to go! Now my favorite "deep space nine" website has turned into a "URL" fanclub. You should kno

Fine Pitch Stencil Design

Dec 14, 2005 | Fine Pitch Stencil Design Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your stencil manufacturer, true, can provide general 's; if so, there's room to reduce on all 4 your designers violate BGA-to-via spacings and/or not enough resist in-between... this is the type of stuff your stencil manufacturer DOESN'T know. A good Engineer will know these things, have a feel for his processes, use CAD tools to design his

Fine Pitch Stencil Design

Dec 9, 2005 | Madam, that's rather forward! By zipper pattern do you mean offsetting the apertures on every oth

Inspection Criteria

Dec 8, 2005 | Satisfactory solder paste should: * Be aligned with all pads * Conform to the stencil pad-aperture size * Have a smooth, flat void-free surface

Insufficient Solder Paste

Dec 8, 2005 | We are encountering insufficient solder paste. Our stencil thickness is 0.13 mm and our printing pressure is 0.08 MPa our solder paste is Tamura TLF-204-19A. Please advice how to solve this problem.

metal squeegee

Dec 8, 2005 | I am looking for Metal Squeegee blades, 15 7/8" long, angled, for a deHart stencil printer model EL-20. Can you recomend me a good and unexpensive supplier? Thanks Greg

Fine Pitch Stencil Design

Dec 8, 2005 | Also the zipper pattern will work too. Samir, why are you calling me a man? Last I checked, the

Fine Pitch Stencil Design

Dec 8, 2005 | I'm with Grant on the .005" foil thickness. The key is to keep your aspect ratio (aperture width

BGA inspection microscope

Dec 6, 2005 | Look when it comes down to it. The Mini Micro Stencil Mini Mirror for $40.00 beats all and is the most cost effective inspection tool out there.

BGA Reball templates

Dec 5, 2005 | Methods for reballing BGA are: * Reballing preforms [SolderQuik BGA Preform ] * Reballing screens [marketed by many including: Mini Micro Stencil, Pace, Topline]

MyData glue station

Nov 17, 2005 | Never could get that thing to work rite. Better off getting a glue stencil or a manual dispenser. Even if you do get it to work it is difficult to control the glue dot size to stay stable either you get too much or not enough.

Manual Stencil Printers

Nov 12, 2005 | we have a DEK 250 for sale excellent condition fully manual

Manual Stencil Printers

Nov 11, 2005 | Hello I would go looking for a SPM with automatic vision or one with manual vision. We know of cus

Manual Stencil Printers

Nov 11, 2005 | i would look at an SPM from MPM(speedline) or an SP200 from Europlacer (speedprint not speedline) We

Use of solder paste after taking out from cold storage

Nov 5, 2005 | Hi, What would you do normally when you have collected the used solder from the stencil each day?

Screen Printing Print Validation

Nov 1, 2005 | Wow, never heard of this. Hope your board cost isn't too much. Most printers have a kneeding procedure that does this while it prints the board. No waste of any kind when you do this. Conditioning the stencil - must've been in a magazine artile.

Need Help for CCGA Rework

Oct 31, 2005 | Why did you choose a 6 mil stencil? How do you plan to rework this device (what machine)? What is the heating method?

Reflow soldering of 208-RQFP-0.5mm

Oct 31, 2005 | If the board is HASL you may always have trouble. Try to reduce the amount of paste by either reducing aperture size of stencil thickness. Jerry

MPM AP25, separation problems

Oct 31, 2005 | Good day, I simply switched the production from MPM to other printing machine. Defect disappeared. Process parameters and process materials were the same. Stencil was the same. �Dog hides� somewhere in the machine. BR, Pavel

MPM AP25, separation problems

Oct 28, 2005 | havfe you tried all paste manufacturers? Dog ears are usually from a little sticking to the aperture walls. this is usually the result of stencil design and or table seperation speed.

How do you number your stencils ?

Oct 27, 2005 | As Mark states, we have also used tape to cover sharpie notes and part numbers. Works well. We use

How do you number your stencils ?

Oct 27, 2005 | Putting some sort of tape cover over the sharpie is not an option? Worth a shot on asking .... sound

class 3 filet height

Oct 27, 2005 | Nearly all of our assemblies have to meet class 3 requirements and we regularly use 5 and 6 mil stencils. If you've got reasonably well controlled processes you won't have any trouble getting class 3 joints on QFPs and discretes.

Defluxing Advanced Packages

 Reflow System