Order by: Relevancy | Date
Jun 19, 2019 | The few timeds this happened to me, it was taken care of by cleaning the feeder thoroughly. Be sure to check moving part for damage.
Jun 7, 2019 | The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt it??
Jun 7, 2019 | Closer pics at angle would seem to support soldermask delam. And I am now wondering if our no clean flux is getting properly inactivated where it is sitting under the mask.
Jun 7, 2019 | dont usually see this unless the Rosin hasnt been hardened due to low reflow or excessive pressure o
Jun 3, 2019 | We see it fairly widely used over in Europe but isnt a particular favourite as if it's not cleaned or prepped properly can be very unreliable.
Apr 15, 2019 | I want to say that waaaayy back when we had an issue like that and it was time to clean the pot. The operator would speed the pump up over time to compensate but it only really helped in the middle of the wave.
Apr 11, 2019 | Thanks for info regarding rotating probe head. We do not recommending to use this probes as it may
Apr 3, 2019 | We still use Via as test points. so we need to paste Via. Pasting will make better contact with prob
Mar 29, 2019 | Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact f
Mar 22, 2019 | Thank you ProcEng1 Nordson sent me a flux suggestion list: No Clean: 1. Kester Select 10 2. ALPHA EF-2210 3. AIM FX-16 Water Sol: KESTER 2331-ZX Nozzle Tinning: SUPERIOR #75
Jan 24, 2019 | Hi Kathy i had the same issue yesterday and find that a spring is not ok. and i also clean the sensors this was fixing the problem for me.
Dec 14, 2018 | High quality coated blades are easier to clean but has zero affect to solder paste sticking.
Oct 24, 2018 | It could be the indicators inside the Z head, have you tried cleaning them? Can you post an image of the error that appears on the monitor?
Oct 10, 2018 | I do not agree with that. Stainless is typically used and it works fine. We run many different paste types, RMA, no clean, WS, PB, Pb Free. No sticking issues. You can spend the extra money and buy coated blades but it is not necessary for most applications.
Aug 20, 2018 | Toluol (toluene). I use it in the solvent cups in my PVA machines to keep the nozzles wetted. We also use it to clean spots where coating is not supposed to be. Techspray 2510-N coating remover pen will also work very well for this.
Aug 14, 2018 | Try something drastic just for testing - turn off cleaning! Then check again the result. Trust me, you can be surprised.
Jul 16, 2018 | problem was solved by cleaning lid bolt connector on chassis... both lid bolt and chase clamps are controlled by SCB34 card, it seams that there is an issue with poor connection on lid bolt triggering this bug. I assume its bug because other card behaved the same way.
Jul 10, 2018 | Looking for any Preventative maintenance steps for SMD storage towers. The MyCronics Owners manual does not specify PM suggestions, however proper vacuuming, lubrication and lens cleaning is necessary. Does anyone have other items to suggest or a list of PM steps for their towers?
Jul 4, 2018 | One more thing. We had a card defect during the control had this problem, on of TBF card burned out. But I think you need to check the thermal paste in the PC - clean the cooler and the filter first.
Jul 4, 2018 | I had similar problem before. I cleaned the PCs (both machine and station) and replaced the cooling paste on the CPU cooler. After time the Control was able to shut off - before the issue solved, we used the safety knob to cut the Control.
Apr 9, 2018 | Thank you, yes I am definitely going to go back through and clean them thoroughly and monitor them, especially at rack location.
Feb 15, 2018 | The question is that we are cleaning almost once per month and that is starting we we start producing a 8layers boards
Feb 9, 2018 | Have you considered Teflon boots over your connectors? 1B31 cleans up quite nicely with IPA. It makes reusable fixture concepts pretty attractive.
Nov 13, 2017 | Hi, thanks for reply. Kapton tape is costly and it may create another handling issue. BTW can you share the thread for the cleaning process ?
Nov 13, 2017 | Preemptively you can apply Kapton tape to protect the gold fingers during reflow. I think that's what most people do. After the fact, there are services available to clean them up but as it was described in another thread here, it is not in-expensive.
Nov 7, 2017 | Best Fluid For P&P Nozzle Cleaning
Oct 5, 2017 | Why not toss a handful of the component that you're concerned about into your cleaner, clean them according to your board spec and the evaluate what happened?
Oct 4, 2017 | For some reasons, we need to wash our BGA boards in ultrasonic washer in order to clean all flux residue under BGA. We use Ultrasonic cleaner with 40 KHz. Should we or shouldn't we do that. Pros and Cons ? Any idea appreciated.
Sep 20, 2017 | Talk to the sales person that sold the equipment. If it is new equipment talk to the manufacturer. You will need electrical power and air. You will want the room to be clean and dust free. You will need to vent oven air to the outside. You will probably need air conditioning.
Jul 17, 2017 | Aqueous Technologies (that's us) www.aqueoustech.com Austin American Technology www.aat-corp.co
Oct 12, 2015 | Cleaning a Used (Preowned) Selective Solder Machine > Problem with cleaning these machines is once you
> start it's easy to get carried away. ;)
> cleaned our SPA-400F a few months ago, had been
> offline for a while as we were using our
> It started as just a clean as the solder can spit out.
> It's useful to turn the heater off every 15 mins
> for a bit to prevent this.
> 5. Fluxer is key as
> has been said. We always clean the fluxer at the
> end of every day and do this throughout the day
> depending on load.
Feb 11, 2015 | stencil/printing machines for solder paste There isn't going to be much worthwhile used equipment out there if you mean true jetting - it is a pretty recent process. There are lots of used stencil printers out there, so from an up-front cost perspective, stencil wins. Jetting is slow. A high end jet printer might quote a million dots per is running the boards. A real 20,000 parts per hour takes a machine rated 30k to 40k, depending on the board and machine. If your line is rated this much or more, jetting WILL slow you down. But low volume high mix suggests to me that it isn't. The upside to jetting, of course, is no stencils. On the low
Nov 10, 2011 | . Modern spray-in-air defluxing systems utilize water as a base cleaning material. In a wash cycle, a water-based defluxing chemical is normally added to allow for the removal of rosin and no-clean fluxes. This chemical additive lowers the wash solution's surface tension, allowing adequate under component %20about%20Rinse.pdf Cleaning for Reliability Post QFN Rework http://www.aqueoustech.com/aquuniv/knowledge-base/Articles/Cleaning%20for%20
Aug 2, 2011 | , INC. (APS) - Huntingdon Valley, PA - - Manufacturers of low to medium volume SMT assembly equipment including manual and auto stencil printers, manual and auto pick and place machines and reflow ovens: inline and benchtop. The standard for low volume surface mount assembly in over 20 countries. APS also manufactures component counters and component lead forming equipment. (215)938-1000, Fax: (215)938-8480, E-mail: Info@APSgold.com AIC TECHNOLOGIES, INC. - Lake Mary, FL - - Manual stencil printers designed to provide the accuracy needed for applying solder paste to PCB's for SMT production. Unique frameless stencil feature reduces cost by rigidly mounting the stencil to the printer's frame instead of mounting a stencil frame to a frame adapter. Micro adjustments provide stencil to PCB alignment. (407)831-2550, Fax: (407)831-2560, E-mail:
Apr 7, 2005 | Hi, I used to run a clean room, and it's right, most of the dust is created internally. You will need to add some HEPA filtering to the area, and an air handling unit that can control temp and humidity as well to get correct environmental control. It's not that hard, but there are other things that can be done. Positive pressure is a good thing, and will keep external dust out, so it's a start. * Reduce or eliminate paper and card in the clean area, as most dust comes from paper fibers. * Don't tear plastic packaging, as the plastic at the tear becomes small crystals that become dust on some clean room garments. These keep dust from peoples cloths from getting all over the place. * There are sticky floor mats you can get and clean room shoe covers that keep dust from being walked in. * Keep horizontal surfaces to a minimum, as that's where dust collects. Try and design shelfs
Nov 7, 2003 | the solder mask. I tried to clean off the surface with various solvents to see if it was by chance on the outside of the solder mask. I was unable to remove the hazing, leading me to the conclusion that it was indeed underneath. I baked one board for 1 hour at 250 F and 95% of the hazing disappeared. I the pre-clean process prior to the solder mask application. The hazing possibly occurred due to poor rinsing/drying of the board prior to the solder mask being applied. This could be mineral deposits from hard water, or some chemical residues that were poorly rinsed prior to the drying process. I only see this problem on the bottom of boards which makes me think of flux, but I've seen it with water soluable and no-clean (Alpha K183 and Kester 951). I don't see it where masking has been applied and then removed. Normally if the solder mask hasen't been cured properly I can remove it with some
Jan 23, 2003 | Cleaning after repair. reaches. That isopropanol carrier takes that flux places you would not believe. We don�t know how you plan to �restrict the repair flux to the area of repair�. * Spot cleaners do not clean the surface. They spread the residues over a broader area and, so, make them less visable. > I am concerned ingredients in various household cleaners and deodorizers. They are effective in removing flux from printed circuit boards and other similar operations. Terpine is a commonly used saponifier used in semi-aqueous cleaning. For instance, the Bioac line from Petroferm contains terpenes. As mentioned
May 17, 2002 | changing from no-clean to clean concerns about contaminating the board should we decide to over-apply WS flux. * Improve pin testability of soldered pads. * Provide better appearance. * Broaden the choice of coating and encapsulation products. * Allow routine process monitoring of process residues. We believe we can clean under high pitch BGA, but know we can not clean under lower pitch BGA. I don�t know your customer, but the thing that gets our customers� attention when we try to talk them into accepting our proposed process or part change is: * �Money, get away / get a good job with more pay and you're O.K. / money, it's a gas
Jan 16, 2002 | Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the solder paste metal %. And, we all know the ideal
Oct 28, 2001 | stencil would have to have pockets half etched into the board side of the screen. Actually this would be the fastest method to produce the product. However, if dispensing would work well, it would give me a lot of flexibility at the cost of speed. I will soon be doing some 3D population and dispensing sounds more attractive. Although, I could probably stencil print too. Not sure which way to go. Conductive epoxy printing is nothing like solder paste printing. Material changes really affect print quality. I will give it some more thought. Thanks, Chris
Sep 27, 2001 | Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are un-bumped you will need to stencil solder paste
Sep 7, 2001 | What pressure is recommended to clean AMT boards after reflow Hi Carol, Pressure requirements have changed over the past few years. In the recent past, aqueous cleaning systems relied on high flow, low pressure �flooding� techniques. 20 � 30 PSI pumped through large orifice nozzles. With ever increasing board densities, decreasing component standoff heights, and aggressive �no-clean� profiles, the need for wider, finer nozzle diffusion (requiring higher pressures) has never been greater. Modern aqueous cleaning systems utilize higher pressure spray systems with lower flow rates. Exact pressure is somewhat brand dependent. Batch-format aqueous
Aug 21, 2001 | 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use WS. Cleaning of assemblies featuring BGA devices may seem at first consideration to be fairly easy due to the large standoff height achieved by the balls. The difference between fine pitch QFP and BGA devices is that it is initially difficult to get any cleaning solution under the parts and then remove it. This is due the leads preventing easy passage of the solution. The package standoff height from the board for a QFP is normally between 0.005"-0.015", which is not normally a problem. In the case of BGA the standoff height is 0.020", but the balls then obstruct the easy passage of the cleaning solution under the device and also impede its
Aug 15, 2001 | . Setting the right squeegee pressure and having a good angle to promote paste roll is most important. With these parameters maximized, a "marginal" blade can give good results. Condition of stencil, flatness of fabs and proper underside support are also paramount to getting good print quality. The squeegee , if well maintained could last years, where as the stencil can get worn out fast if all other parameters are abused.
Aug 7, 2001 | volume of paste. Then when you see too little solder on your boards, wammo you can ask them why those controls went south and how they plan to prevent recurrence. * Stencil tension. If printing with a zero snap-off, which virtually universal today, stencil tension becomes a very obscure measure of success. We spoke about this in the archives a while ago regarding frameless stencils. The answer was ah, umm, er, so enlightening that you should read it yourself. * Stencil thickness. Are you concerned about the stencil wearing-out from too many prints? Most stencils are stainless steel. They aint
Aug 3, 2001 | Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after it fail the release(well a stupid mistake
Jul 31, 2001 | Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider the tooling will normally be set with a stencil on top of the PCB (for stencil printers) A high-accuracy force gauge was placed above a pin when the pin was retracted. The gauge was set to record the max force encountered. The average force was 5 gram force (0.18 ounce force). The pins can literally be stopped with a piece of paper at their most
Jun 27, 2001 | , try increasing the metal on the board with: * Thicker stencil. * Bigger aperture area, maybe using tear drop shapes. * Second print cycle using thicker stencil and openings on bottom side for previously printed paste, printed for non-PIH components. * High metal content solder paste. * Dispense your
Jun 15, 2001 | Timed an actual Change today. It took about 6 min to actually change the head and then about a 2 minutes to start printing again after installing the new stencil & loading the program for the next PCB. The whole thing including stencil swap out & program load took about 12 minutes total. When I
May 14, 2001 | pad, as well as from pad to pad. The little bit of exposed copper at the edges of the pads is not an issue. It is actually acceptable per IPC, provided you have good wetting and meeting the joint specs. There are several ways to approach the step stencil. One way is to run 2 stencils, one
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196