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Mar 21, 2005 | I agree with dave. Two things prevent oders from drains. The "P" trap and the celing or roof vent. I
Mar 21, 2005 | Sounds like a flaw in your trap. It seams that during the pumping process the trap is ineffective or
Mar 17, 2005 | When it comes to solder paste, you should worry about volume. Granted height is a part of the equation, but you could have perfect height and still get defects. I wouldn't get too wrapped up in volume either, unless you're evaluating stencil height, squeegee blades or such.
Mar 14, 2005 | what did your D.O.E. studies show you as the critical parameters? These are the ones that you need
Feb 28, 2005 | I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components can be done with good yield in a production
Feb 13, 2005 | Hi, Cool, and thanks for the info. Can you email us with the costs? I checked out your web site a
Feb 12, 2005 | Lead free samples are available at http://www.sipad.com/SIPADLeadFree1.htm No stencil needed, the boards are pre-loaded with paste in a solid form and adhesive flux. Check it out. Matt Kehoe
Feb 9, 2005 | Good day all, I am wondering if there is a company out there that sells kits that contain a board, components and the stencil? When we get our new reflow and wave machines in I will need numerous boards to run and evaluate until I can get the process nailed down. Any suggestions...or different
Feb 4, 2005 | The base model UP3000 is really a general designation for the platform. The use of "UP3030" designated the configuration of the machine from the factory. The UP3030 (if memory serves me) came with 2D, a vacuum stencil wiper, and a paste dispenser. It may also have some pin-placement system
Dec 17, 2004 | I agree with dave. However, if you can not afford those expensive cartidges, you start putting enough solder paste on the stencil so to minimize waste. I agree you have to dispose of the excess dried up solder but if your process is not very critical you may experiment on putting some flux. However
Dec 13, 2004 | I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad? What is the Fab finish? Bake the parts and fab
Dec 3, 2004 | Dreamsniper, We would need much more details about your process to help you to determine the source of voids. Type of paste, how long you leave your paste on stencil, your relative humidity, reflow profile, type of oven, oven environment (N2?) and so on. All those above can contribute to voiding
Nov 8, 2004 | In addition to type of paste, it is also dependant on the enviroment conditions. When you say open jar are you implying that the jar is left open all day and then at the end of shift it is closed back up? Jars should only bve open for about 30 secs at a time so you can stir and apply to stencil
Sep 20, 2004 | Hi Chris, Acually, it worked pretty good. We made a new blade from SS. We were not sure if it wou
Sep 12, 2004 | MAke a new stencile and have the aperatures reduced by 20% in X and Y. This has solved 90% of all solder balling issues I have ever dealt with. Be careful with your fine pitch and micro-BGA's. If you are not having problems with fine pitch and 1:1 aperature, you may want to leave those alone.
Sep 7, 2004 | Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of auto stencil wipes, and keeping the paste
Aug 5, 2004 | The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow time...Thanks anyway! Regards! Bryan
Jul 30, 2004 | Hi, Very interesting article on tombstone issue, i'm facing tombstone issue for 0805 IDC component, i've redesign the stencil aperture and change to lead free paste, the tombstone is reducing but not fully eliminated, however there is a problem i face on the rework process for 0805 IDC capacitor
Jun 16, 2004 | Have a look at the following link. We have bought two of these wallet storage systems for our foils.
Jun 15, 2004 | Just an idea... Try investigating methods for storing large drawings. We have a hanging file cabin
May 14, 2004 | Perhaps you can try to use the new StencilQuik(TM) technque as it more easily facilitates solder balls dropping onto the pads. Info at http://www.solder.net/stencilquik.asp
May 4, 2004 | to stencil print onto the board.
Apr 26, 2004 | so the first PCB if i want to aligned with stencil is manual the same for screen printer without vision and vision starts work for next boards? or i am wrong? but if i make mistake during aligment process for the first PCB i will repeat it for next PCBs. what is Mylar? what if i don't have Mylar
Mar 26, 2004 | I'm keen to find out more about the SAWA cleaner. What type of solvent is being used. Does anyone use water or any other enviromentaly friendly agent. Is the result with glue stencils good.Is this a messy machine to use. Any feedback would be good. I would like to see the back of our old dinosaur
Mar 3, 2004 | 2D will give you on-line contrast inspection for paste coverage on the land. I would go with 2D on t
Feb 23, 2004 | Just to finish this up, We did manage to print this little part with good success without any major re-setup of printer settings I would not recommend these parameters for production to anybody however. You can print 2-3 boards before it starts to clog the stencil. Fortunately we only had
Feb 21, 2004 | Does anyone have a good test to check the knowledge of job candidates for SMT Tech's? We have some good tests for test candidates but need something for SMT people. (like how do you determine optimal stencil thickness or how do you determine what squegee pressure should be) Anyone looking for a
Feb 15, 2004 | i have always found any of the alcohol based solvents good.here in the uk we use the alpha make.wit
Jan 15, 2004 | Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder paste particle size ? Any feedback would
Jan 12, 2004 | High temp balls (spheres for you PC types) They are non-eutectic balls. Do you have a reballer or stencil setup? If one device...may not be cost effective, but if many you can usually send back the the IC house for re-ball. There are only a handful of BGA foundries that do this work. Your IC
Jan 12, 2004 | , vacuum under stencil wipe, auto paste dispense for 45k? Thanks you
Jan 10, 2004 | hi grant, why you choose not mpm is clear for me not good support possibilities localy, dek mayb
Dec 15, 2003 | I would say the DEK printer I have had the best reliability with. I have used the MPM and had alot
Dec 10, 2003 | CHECK INTO WARRANTY AND SERVICE BEFORE MAKING THE DECISION ON PRINTERS. WE CURRENTLY HAVE A DEK ELA.
Dec 10, 2003 | I agree with all the comments saying MPM and DEK are OK, but more that spent those $90 KUSD in the m
Dec 3, 2003 | Hello As some one already said Dek and MPM printers are very good and reliable printers. I have be
Nov 5, 2003 | I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could be setting yourself up for a bridging problem
Oct 13, 2003 | Hi Andrea, Another good place to start in addition to the oven manufacturer is your solder paste vendor. They can help you select the correct paste and give you the right reflow profile to use for that paste. Keep in mind that most vendors (paste, stencils, ovens) will be willing to give you help
Sep 26, 2003 | Thank you Russ for the information. One more clarification- I found that the %metal content in lea
Sep 4, 2003 | I'm attempting to develop paste in hole process so that I can reflow a few plated through hole components on a mixed tech board. Tried various pastes, profiles and stencil thicknesses. Would appreciate any insights and/or pointers anyone can share on the process. Thank you.
Jul 2, 2003 | ???? What? I think I follow your logic. Bottom line is, using the same name, p.1 (that's p (dot) 1) over and over for every stencil you produce can lead to confusion both in our CAM dept as well as our vendors. Like calling every board you produce PN 123456 over and over and over again. Would any
Jun 17, 2003 | Consider searching the fine SMTnet Archives for discussion, for instance: Apr 9, 2003 | This just makes my head hurt.
Why do these 22 BGA with hundreds of solder connections each have "open circuit due to the lack of solder paste"? Something just doesn't sound Kosher. Tell us about:
* Stencil design
* Solder paste
* Board design in the vacinity of the BGA pads
* Board fabrication
Apr 9, 2003 | This just makes my head hurt. Why do these 22 BGA with hundreds of solder connections each have "open circuit due to the lack of solder paste"? Something just doesn't sound Kosher. Tell us about: * Stencil design * Solder paste * Board design in the vacinity of the BGA pads * Board fabrication
Mar 28, 2003 | Hi Have you noticed with 3D scan technology a flatter and more filled top with the Rheometric when printing the smallest of aperatures. The Applications guys from the 3D companies told me they did see flatter tops. Granted this has to come also with better stencils. YET I was wondering your
Mar 26, 2003 | Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't h
Mar 10, 2003 | May I be the first to ask, how you plan on applying paste to the primary SMT? You won't be able to stencil it on as is typical. Do you have a paste dispenser? Also a lot of PTH parts can not take reflow temperatures, not even all SMT parts can. (been there done that, oops)
Mar 7, 2003 | with it, if you wish to remove the gold you will need to cover it with solder past and have no stencil reduction.
Feb 11, 2003 | manufacturing process change to use different stencil thickness. ... More Paste, ... More Waste!
Jan 29, 2003 | Hello!! I need to know the land pattern specs for a melf resistor with dimensions length 0.415(+/-0.02) and width 0.144 (+/-0.008) inches. Because i have tombstone problem. My stencil design is 10 mils thickness in order to avoid the issue but it helped me just a little bit. Thanks in advance
Jan 9, 2003 | It depends on what the finished solder joint looks like after reflow. Use IPC to determine your sol
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