Order by: Relevancy | Date
Sep 3, 2003 | -emphasis of IR and vapor phase reflow. * Largely eliminating the use of freon [and the like] in cleaning boards. And it�s corollary, realization of low residue fluxes in soldering. * Dissemination of knowledge through SMTA, conference training, trade journals, internet message boards, and the like.
Aug 21, 2003 | For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process? Worst case: what if the vias are solder mask
Jul 23, 2003 | Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like
Jul 17, 2003 | So, how do you know it's "oxidation"? If the parts didn't solder, why aren't the parts the proble
Jul 9, 2003 | Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we're not sure from the language used. They going
Jun 18, 2003 | Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30-90K for a printer and go from there. Hand
May 30, 2003 | Ben- My understanding of Tacky Flux is for Automation process where the Tacky Flux helps hold the component in place. If you are using a rework system that holds the Board firm..then typical no clean flux (Flux Pen) should work fine. I can only asume the type of rework station you have. Typically
May 19, 2003 | Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multiple copy arrays from 7"x9" to 7"x13" in size
May 7, 2003 | on the more likely it is to pop off during reflow.A small piece of Kapton ontop your dot helps too. What glue are you using? We are using Dymax 3073. I don't have any residue problems after I pop probes off.The area where the dot was appears to be clean as a whistle after I pop it off.
Apr 30, 2003 | In all likelihood, you may not be leaving flux on the board rather you may be leaving saponifier on the board. Improper rinsing is a leading cause of cleaning related board failures. The problem with some inline cleaning systems (especially old ones) is that they lack proper rinsing. The final on a board. Saponifiers are much more ionic than flux and therefore are much more conductive. Additionally, a saponifier may continue to �attack� a board after the cleaning process if not thoroughly removed. The fact that you have enough leakage that can �light an L.E.D.� leads me to believe > If nothing is wrong (defective) with your old Hollis and profiles are in order and better chemicals do not solve the problem then you may want to consider purchasing a new cleaning system. Mike Konrad www.aqueoustech.com email@example.com
Apr 28, 2003 | The BGA rework process has been qualified for space flight. Which basically means someone sensible over in ESA has been replacing BGA's and life testing them. I agree the best way is to build clean boards without any mistakes, but i can honestly say that i have never seen one of these!! It's like
Apr 9, 2003 | it is going to get real boring just removing and cleaning the 22 all at once. As a side note, be careful when you are removing them you will probably want some cooling intermissions now and then. Russ Russ
Apr 1, 2003 | You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining the 20th Century by changing to low residue fluxes
Mar 4, 2003 | Hello Ryan, I'll be completely honest, I haven't seen anything on the radar scope but I haven't been tuned to ESD issues. Everything I've seen in the industry ranges from complete compliance with Class 10,000 clean rooms to questionable use of foot straps. As products dictate and customers demand
Feb 28, 2003 | know what cleaning method removes the product. Water won't remove some of their products. YiEng, MA/NY DDave
Feb 27, 2003 | washers and what options are highly recommended? I have chosen these washers due to space constraints (<20�). Austin America Hydrojet Mach I Electrovert Aquastorm 90 Technical Devices Nu/Clean 318 Trek Triton If I have left anyone out you think I should consider please let me know. Your input
Feb 26, 2003 | -place of the pot. Finally, bag cleaning the solder from the via and just solder the wire to the via pad and drop a dollop of indutrial strength epoxy to secure the wire.
Feb 7, 2003 | For all of the ranting about "sales-types" using the forum inappropriately, it's nice that some of t
Feb 5, 2003 | the relevant nozzels on a single head and see how it runs before I doing them all. Removing the bearings and giving them a good clean before applying a small amount of this grease (or an equivalent) would be a good starting point. Lloyd
Jan 15, 2003 | to reflow hotter etc for the silver? Also our paste is no-clean without silver..would the addition of the silver in the paste cause better bonding (silver and silver etc..etc...). Any thoughts?
Jan 3, 2003 | cleaning solvent? Have you talked to Mike? Is your EFD manual printed in German like mine?
Nov 25, 2002 | That's basically it. In a wonderful world, the oxides flow on top of the flux during heating through reflow. Obviously when compared to reflow soldering, you create much more dross with your wave by: * Pumping a large volume of very hot solder to have contact with O2 in the air. * "Cleaning" a
Nov 22, 2002 | at 110 c. Just another thing we might overlook is if your flux has seperated from the paste when you assembled. Are the boards clean ? contaimination on the board finish can be checked thanks
Oct 31, 2002 | which led to something not being cleaned (if I remember correctly) from a layer inside the board. The heat brought some of the residual chemicals to the surface through small pits in the vias and through holes, this would blow through the solder leaving nice little holes.
Oct 2, 2002 | The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [l
Sep 26, 2002 | unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull,
Sep 25, 2002 | Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. Get your paste rep in there and have him
Sep 23, 2002 | Isn't this a blatant violation of rules? Couldn't Bill have e-mailed a response directly to the pos
Sep 23, 2002 | Michael, If you do not find the information you are looking for in the archives, call me and I happ
Sep 19, 2002 | Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally would not do the trick. Plasma is great
Aug 29, 2002 | and number of clean / wash cycles that these boards see. * Age of the boards. * Conditions and packaging during storage. Were these boards solderable when you received them from your supplier?
Aug 28, 2002 | the die (lighting/reflection is a big factor when placing die on the pick and place machine) Cleaning baskets-special cleaning baskets were made as boards/ceramic would bounce around during cleaning (pressure of spray washer or dryer on cleaning machine). New baskets keeping the peices from moving around
Aug 14, 2002 | One thing we did for our oven is hook it up to the compressed air system in the factory and bled in a small volume of air to create a positive pressure in the oven. The air is clean (non-oiled) and comes off the dryer. We can attain 5% RH. Remember you are just trying to create a positive
Aug 13, 2002 | profile is correct (slightly above 150 for around 2 minutes) and have checked the exhaust flow rate, which is also adequate. What is causing this and can it be prevented? If not, does anyone have a good idea on how to clean out a 3 meter length of chimney?
Aug 9, 2002 | Just started doing BGA rework. After the removal of the "old" component and after site cleaning/component reballing I am ready to install the component on the PCB. It is recommended to apply flux or paste to the board/component. I would appreciate more information on why paste is used over flux
Aug 2, 2002 | Hi CarlN, I�m quite surprised that you viewed my response to your question as a �canned response�
Aug 1, 2002 | Chris, OK, sounds like it may be more of an equipment problem: "The solder balls are randomly dep
Jul 31, 2002 | Used this paste on ENIG boards W/O N2 and had very good results. (0402's,BGA's,16mil FP) Never had t
Jun 5, 2002 | is stored for above the recomended time from the refrigerator prior to use. Wipe is fine this would also be detected using inspection pre-reflow. When we have poor cleaning from mis-prints this gives different (definate) results. I have simular thoughts to the theory, but I am struggling to find out
Jun 4, 2002 | heating? * Inadequate under-side wiping during printing? * Poor misprint cleaning? * Operators not removing gloves during board handling? We've talked about this previously on SMTnet. A search of the fine SMTnet Archives on ... solder and gold and finger ... gives over 130 hits.
May 18, 2002 | become wrinkly above a 215�C. Hmmm seems unusual, but it could be. * Assuming you're using a no-clean solder paste: if it is going 'milky' colored, that is usually caused from water, even moisture in the air. * Often wrinkly solder connections are caused by rapid cool-down.
May 9, 2002 | I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought was a quick solution ended up becoming a component
May 8, 2002 | Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts into water(dilute HCL). after water soak
May 7, 2002 | Hi, I reaaly mean AG (Like silver) we was thinking about going with immersion gold butis a bit more expensive. we use a no-clean paste but in a few year( maybe 1-2) we suppose to change to a lead free. You said that with Immersion gold we change nothing in your profile, the only spec
Apr 29, 2002 | and you just wash it with ionic water or just water.You could also try Surpclean from Microcare it is good but expensive.We use that.This still does not solve your problem that you have to clean boards by hand. Good luck Regards, MadReindeer
Apr 26, 2002 | We conformally coat over NC solder paste. No problems. We're using a platinum catalyzed addition c
Apr 24, 2002 | We�ve been using WS609 for a long time, also. Life or death based on what you�ve said? Choices are: * Wash water is too hot >50�C. * Boards are too hot to be cleaned. Yes, saponified cleaners will remove heat decomposed WS flux. Well, I suggested changing paste to another poster, because he
Apr 20, 2002 | If people use an inert gas, they use nitrogen for mass soldering. Inert gases get progressively more expensive as you move down the periodic table. Many times no-clean flux is less active than other flux types. So, people use an inert gas to lower oxidation of solderable surfaces during preheat
Apr 16, 2002 | are programmable), Because it is completely progammable, different products can be run at any time by selecting the appropriate program, and new programs are easy to create. Maintenance, cleaning, warm-up, safety, are all pluses for the microflame and can help with justification.
Apr 15, 2002 | '. Certainly this a boardly accepted cleanliness level, but we will monitor the cleaning process for your boards to any standard you like. [smooch, smooch] Assuming you truly did something like that. Check J-001 for the basis of this blathering.
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