stencil cleaning

"stencil cleaning" search results in the Electronics Forums



9777 result s found for "stencil cleaning" in the Electronics Forums

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Humiseal 1A33 conformal coating using automated atomized spray

Jul 3, 2018 | Aquanox A4241 liquid to clean flux residues and using Oxygen only plasma to deal with surface energy issues. Visibly, we don't see flux residue under the microscope. Should we consider using other gases that would affect the contact angle of metal surfaces (Maybe, argon????) Are there any detrimental effect of oxygen-based plasma cleaning on metallic surfaces. The material that we are utilizing for this purpose is Humiseal 1A33 Urethane based conformal coating compound mixed with the recommended thinner in a ratio of 1:4 (as supported by the material TDS). Should we consider increasing viscosity

Testing effect of non-clean flux residue on solder joints

Nov 3, 2017 | Testing effect of non-clean flux residue on solder joints is ionic and still needs to be cleaned * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Fire hazard with a flash point (~12*C TCC) * IPA is a volatile organic compound (VOC) at 1000 g/l * IPA is harmful to people, requiring personal protective equipment including

Acrylic Coating De-Wetting?

Jul 25, 2017 | process outline: - Wash (Aquastorm with chemistry, can't remember what we're using off the top of my head) - Bake (about 100c for a couple hours) - Plasma Clean (confirmed that adhesion is greatly increased, waiting for dyne pens to confirm, contact angles on DI water drops go from near 60 degrees , to almost nothing at all, so surface energy shouldn't be a problem) - Mask (ATS-667 tape for masking, known compatible with AR coatings, no silicone adhesives) - Plasma Clean again if too much time has passed during mask stage - Coat, 3 coats per side, resulting in 2-2.5 mil finished thickness as measured

White spots on PCBA after Selective Solder

Sep 11, 2015 | ) Changed the flux ----Current stop gap solution---- Cleaning with flux (surprisingly) and a subsequent DI wash process seems to make the white spots go away. We're hunting for the cause and fix it so that we don't spend extra time trying to hand clean the spots.

Universal GSM Feeder Issues

Aug 10, 2015 | -pins and the machine, but, most times, I am unable to get the feeder working. So far we have tried cleaning the contact areas on the machine, cleaning the contacts of the pogo-pins, as well as jiggling the feeder once installed to try to find a magic work point, all to no avail. Today, I'm having it at random spots

BGA epoxy removal

Feb 22, 2015 | Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone, iPad and Samsung boards, and all of them have some kind of epoxy under the bigger BGA chips. The Apple ones have a black, type epoxy that when heated becomes kinda less hard but, almost every time we try to clean the space where the new chip will be mounted we damage some pads. Currently we are heating the spot to 200+ C and scraping with a sharp

SRX AUTOBAUD

Sep 25, 2013 | properly Measure line voltage & re-tap 2 Check Mod Codes MC’s 42, 43, 44, 45 3 X or Y Encoder defective Check the EEI & EHD board LED’s Clean & check glass scale 4 X or Y encoder cable defective Check the EEI & EHD board LED’s Clean and check glass scale 5 X, Y, Z motors defective Check & measure

Preventive Maintenance

Jun 18, 2013 | We recently had one of our older machines ( DEK 265GSX built in 1996 ) begin to have a problem of shutting itself down without warning, after checking out whatever I knew to try and find the cause, I pulled out the Y3 enclosure and removed all the cards to clean the edge connectors, visibly check and cleaning control cards on this machine and others would be a good idea to do on a regular basis, like every three months. I say no for the following reason: There is always the chance of damaging the card when it is pulled out, especially on an older piece of equipment and if there is no problem present

Water Cleaning PCBs

May 30, 2013 | Water Cleaning PCBs In general, it would not be advisable. DI water is used for a couple of reasons. First, the missing ions aid in the cleaning process, as they seek to bond with the material on the board, allowing the water to act like a fairly aggressive solvent. Secondly, the deionized water should contain

Adding new line

Mar 20, 2013 | the same reels, etc. When you import the BOM into our ProntoVIEW-MARKUP module (see YELLOW in picture) we crosscheck the CAD and BOM and clean it up if needed and then a clean standardized bom can be generated, but we don't do this across multiple assemblies. Certainly because BOM's are now in a

Machine ICOM 5000

Dec 7, 2012 | Your machine is a quality control tool. It's good for measuring trends, like the way that you use the scale in your bathroom. It's not intended to be an absolute measure. Background on cleanliness tests * http://www.empf.org/empfasis/oct03/603clean.htm * http://www.empf.org/empfasis/jan02/contam0102.htm * EMPF report RR000013, "An In-Depth Look at Ionic Cleanliness Testing". Request it from

MPM Up2500 Tactile 12-Hardware Limit Warning?

Oct 20, 2011 | Make sure the housing for the switch can move up and down freely (no lose parts/screws and the lead screw is clean and lubed with some light oil). I've had a tactile housing come loose from the lead screw = limit errors - it should be tight with no slop. Go into I/O and see if the tactile switch is working. However, even if it appears to be fine in I/O, many times the switches get flaky. Replace it with a new one. Additionally, if your tactile has a metal plunger on it, remove it, clean it and apply some light oil. Also, I think there is a flag for the up position. Verify it is aligned

Unusual solderability issue

Apr 19, 2010 | and sulfate. They stated that the level of silica was high enough to cause solderability issues and recommended a cleaning process. The cleaned boards were perfect. Unfortunately by the time we received these results we had moved all our high end boards away from this shop so we still can't confirm

gpu removal

Sep 18, 2009 | a learning experience. I use a higher flow rate for removal and for larger parts. Too much heat, for too long, will make your job harder. The pads will oxidize and the adhesive that holds the copper to the board will let go. Once the pad is oxidized you will need to clean it off. I have heard -tin the pad. There are chemical solutions for this, or you can use a good flux and solder (which will need to be cleaned when finished). When doing the work, I highly recommend that you get some magnification. For easy stuff, I use 2.3X Heine loops. For smaller stuff I use a variable magnification (with long

ionic residues on the surface of printed circuit assemblies

Sep 2, 2009 | Advanced Cleaning Solutions is a Johnstown, PA based electronic manufacturing service provider (EMS) with more than 3,500 square feet of ESD safe facilities. Our services include precision PCB cleaning and ionic cleanliness testing/verification using either the Omega 600 or Zero Ion testers. ACS

Urethane Coating (1A33)

Aug 26, 2008 | 't really offer you any comparisons. I can tell you that your customer probably wants an oven cure because if you let 1A33 air dry it can pick up and orange tint, while oven drying tends to leave it crystal clear. In my opinion it can be a pain to clean off the boards once completely hardened. I recommend picking up the manufactures recommended remover in case you have any problems or need to spot clean to remove a part.

What caused this reflow issue?

Apr 17, 2008 | the boards are subjected to the reflow process they want to outgas any solvents or uncured laminate resins that may not have fully cured during the fab process. I'd also suspect other contaminates possibly from operators or inspectors. You may want to clean these PWBs before applying solder paste. The fact that there is no evidence of solder wetting or even flux residue on or around the Q19 heat sink / ground pad is a pretty good sign that the pad was isolated so that solder couldn't adhere to it. This is assuming that the board has not been cleaned. There appears to be a small amount of flux residue on the top right Q19 pad

Comformal Coating Stripper

Feb 28, 2008 | .] for cleaning the stripped board? * What type and level of skills do you suggest for the operator stripping boards? * What type of personnel protection and ventilation do you suggest? * When you ran �minor vibrate/agitate,� what was the temperature? * How does increasing the temperature affect the stripping board? Is this a degradation of the bare board laminate? * Did the stripper affect the solder mask? * Did the stripper affect metal of the copper traces on the board or the leads of components? * How did you control the �cleaning effectiveness� of the stripping liquid after stripping multiple boards

Solder Tip Tinner

Jan 15, 2008 | We believe that tip tinners reduce the life of the tip, also. Why do you use such a product? We like using solder paste to clean solder tips. Place expired solder paste in a covered container. Open container and dip the tip. It comes out clean and shiny. Also, we like tip cleaners: * Xytronic Tip

Cleanning no clean residu

Oct 22, 2007 | Bruno The real question about your troop using Kester 951 wave solder flux on boards is: how is t

CSM Technical Question

Oct 11, 2007 | Jon, Thank you for your input, I think you may be correct in that the Brd./Comp. of Fid data may not be correct any more. The unit was caught up in a flash flood just high enough in our facility to get the processor board. After cleaning and drying all powered up fine "origin , Manual opperation . But when loading the program it just gives an error I think it said error 79 opperation interupted. When I looked into the program I found glitches " white squares ar $ sign's where numbers or letters used to be letters or numbers missing at randum. I tried to clean them up "edit them" but still had

Mydata A12 tool tip damage

Jul 20, 2007 | plug up the bottom of the ELMO unit causing it to overheat and when that happens the power resistor in the bottom of the ELMO will blow up inside its heat sink (learned this the hard way). We clean the card cages fans and cage itself annually now. This entails removing every card, Elmo power supply and blowing the cage out, vacuuming the foam under the cage inside the machine, cleaning the circulation fans under the cage housing and the main intake fans in the rear of the machine. Cooling of these machines is very important for repeatability and consistant operation without failure. We have halfed our

Reflow Profile Design

Jun 15, 2007 | clean break, and often there is clean hold pads under the part after it's broken off, so the solder does not look like its adhering to the pads correctly, even though the product tests ok. We have run our profile specification window 6 degrees hotter in the reflow part of the profile, above what

DEK pro-flow

Feb 12, 2007 | : (Downloads can be found under Process -> Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators and Engineers solutions, including: The VectorGuard stencil system, Galaxy and Europa Micron-class printers for advanced SMT and semiconductor applications, RTC (Rapid Transit Conveyor) to enable a 4-second cycle time, Interactiv� machine support and ProFlow� DirEKt imaging for paste, adhesive PumpPrinting� and optimal lead-free printing. All of these latest innovations, as well as DEK�s full line of automatic and semi-automatic screen printers, sophisticated stencil technology and consumables will be on display. DEK is pleased to announce that both Cyclone and 3D Find-a-Part have been selected for submission

Indium Solder Hermetic Seal Voiding

Jan 10, 2007 | to use > Rosin flux for cleaning purposes, but could go to > an acid flux that can be easilly cleaned. Any > suggestions for fluxes or profiles when making a > hermetic seal of this type? I once used 60/40 In/Pb NC solder paste for soldering to gold bumped flip chips. Used the In

Contamination

Aug 15, 2006 | Alpha UP78 was a modern solder paste. Check with your supplier for recommendations. You're are cleaning some flux residue with the IPA and reducing the leakage current. We're not wild about using IPA. Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed

Poor soldering on fine pitch?

Jun 8, 2006 | We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had the same problem with both tin/lead (no-clean , and SAC305 (no-clean and aqueous). The problem is with QFP100 & TSSOP48 packages. They just don't seem to want to solder their leads down correctly. We have leads that seem to be soldered, but with a little poking come right off the pads. SOICs, 0805s, 1206s, crystals all seem fine. Now I have a couple

cleaning PCB's

Jan 10, 2006 | cleaning PCB's -based defluxing systems utilize environmentally safe and highly effective chemistries. An aqueous-base system is capable of removing all flux types including water soluble, rosin, and no-clean (both 63/37 and pb-free). There are several manufacturers to choose from including: Aqueous Technologies (that�s us

gold wire bonding

Dec 29, 2005 | well below 4 grams with 0.0033 inch diameter wire. I also do not plasma clean at all. Plasma cleaning may give you that extra advantage that I do not have. With 0.0033 inch diameter wire, I get at least 12 gram pull strengths and average about 14 gram pull strengths. My stitches are security bonded

dendritic growth

Dec 14, 2004 | or random, same for the crystal growth. Do you see dendritic growth without the crystals or are the crystals always present on locations with dendritic growth. How did you clean the boards with water or solvent based cleaning. Analyzing the sequence of tests you did (and not having answers to previous

Coating adhesion problems

Sep 21, 2004 | > Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board > after cleaning with IPA with the conformal coating? > Going back to > your reason for IPA cleaning, if you are trying > to remove filings from your Rototrim, why do you > need to use IPA? Is the flux res sticky? Well, I'm not sure about it, I really beleive that process is there since the regular fluxes were used. I have

Lead Free ...

Aug 31, 2004 | Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the coating thickness on your pads change and the shelf sides. Shelf life is different on this PCB either. Here is a part of the article ... Production experience has shown that hold times of up to 24 hours are typical and SHOULD NOT be of a concern (NOTE: This is not apply to PWBs that have been wiped-down or cleaned with solvent. For us, after SMT

Electromigration Testing

Aug 18, 2004 | Davef, Sorry for the late response. I was trying to gather more info. The group with low ionic contamination levels came from one of our other facilities. We want to outsource more of our product due to increasing demand. Both groups use the same no clean flux and manufacturer, Aim. The only differences between the two groups that I know so far are: Low Ionic Group B Ultrasonic Spray Flux Solder Paste (Sn62) Enclosed Area (clean room type) Higher Ionic Levels - Group A Solder Paste (Sn63) Reg. Spray Fluxer Lowered the flux amount and improved ionic levels to 16 - 17 ug/in^2 although affected

Warming up solder paste at start of days production

Jul 26, 2004 | we tried to do vapor phase reflow on the kitchen hot-plate with a pasta cooker. It worked, but we were so excited we kept taking the lid of the pot, and the vapor got out and condensed everywhere. It's really hard to clean up because it does not evaporate well at room temperature. The fluid coated in. So we really messed up the kitchen where clients normally prepare their food. It was a really trendy slate kitchen etc. So we desperately were trying to clean up before anyone came and noticed. But it worked really well, and we reflowed two new prototypes the morning we had to fly

Can anyone recommend a reflow profile for already flowed solder?

Apr 21, 2004 | Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This works well with our failures from test, where we

contamination on copper

Apr 16, 2004 | Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than the opaque, light green color of an achitectural -on flux residue, which makes it difficult to clean properly. [Ah, if only buyers would realize the problems they create in "saving" a penny on the cost of a part.]

OSP Handling

Jun 27, 2003 | Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.35um thickness is indeed thin. * Training long. You might have problems if you run side A on Monday, side B on Tuesday, and wave them on Wednesday. Especially if you have additional processes, like a few water cleanings. * If you use alcohol to clean misprints from screen print or the SMT adhesive process, your WIP shelf life is reduced , OSP typically does not wet (accept solder) as well as some of the other finishes, and many folks have a tough transition over to no clean wave solder process with OSP products. Top side solder is a bit more difficult to achieve. So you may need to invest in a nice spray fluxer if you don't already

ESD Safe Flooring Systems

Feb 10, 2003 | Hi I am in favor of the best money can buy tiles, and everything including an ESD officier and training for everyone. Long term less money is spent and ESD protection is kept high continually. Boy do I have stories like the cleaning guys who put on non conductive wax on a beautiful floor, and, and used by some company that used chemicals. What the business was escapes me right now. Even though the floor was cleaned really well before the conductive epoxy was put down the concrete, which is porous, continually would let those chemicals back on up and you would have ESD breaks. So what ever you

Air bubbles in solder joints

Oct 30, 2002 | suggets that the cause of the problem is in the pre heat stage of the reflow process, where the flux has not had enough time to vapourise and clean the surface for soldering??!!! This does not sit well with me as we run another suppliers boards, exactly the same board design, and we expereince is not being released out of the solder paste to clean the PCB finish.( whichh I think is a load of crap) Any assisitance or guidelines in relation to this problem would be very much appreciated.

Vent Residue Cleaning

Aug 14, 2002 | Vent Residue Cleaning the joints of the vent tubing wrapped with a metallized version of duct tape. That stopped the constant drips. Secondly, I had a "P" trap installed so that the condensed flux residues would pool in a trap filter. That area could be pulled/cleaned/replaced periodically. A good HVAC contractor can evaluate you

Water Residue Stains - how to remove?

Dec 19, 2001 | the pallet before oven-bake drying process. Now the side facing down in contact to the FR4 pallet, is "spotty" with water-stain marks. As this affected side is the contact pads for the end-product "reader" unit, my customer says the water stains are not healthy, and require us to clean up the stains... we already tried prozone/IPA, and this only "cleans" the pads temporary, after the chemicals "dry-up" the pads have darker-yellowish water-stains again... I think the flex-PCB pads are either gold/copper in primary content, and my thinking is if its predominent copper, then the water-stains are stuck

Smurf Coats

Dec 10, 2001 | when they get scrufty. * One being cleaned. * One cleaned. We are very unhappy with the cost of coats ~$150 per employee. We recognize there is a balance between trying to "save" too much money when buying coats [You get "plastic bags" that get too hot for the people wearing the coats.] and getting a

Non-wettig on chip cap.

Dec 6, 2001 | secs, time to 183 Deg C ~ 5 minutes, peak = min 215 � max 220 deg C. b) Solder paste � I had tried 3 types 1) Delta 738S2 Water soluble 2) Delta 670S1 No-Clean 3) Indium SMQ-92 No-Clean I would appreciate if any of you guys can help me with suggestion or what should I do ? Thanks very much

Solder balls on Cleaned process

Oct 18, 2001 | Solder balls on Cleaned process , selling your washer for BIG bucks, and taking everyone to lunch with the proceeds of the washer sale. * New flux supplier. Recently, a sales type pitched us on a washable flux that reported doesn�t have to be cleaned between reflow cycles.

Solder balls on Cleaned process

Oct 17, 2001 | Solder balls on Cleaned process semi-cured concrete and entombed the solder balls loitering around, while awaiting further processing. * Second reflow [of the primary side] fully cured the flux residue from the first reflow. * Aqueous wash after the second reflow did a wonderful job of cleaning the residue and solder balls from

Solder balls on Cleaned process

Oct 17, 2001 | Solder balls on Cleaned process We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps which located at an open area. 2)Open time is too

Saponifier needed to stop

Oct 8, 2001 | No wizard here just a troll....Sorry I can not spout a Fountain of information Like "The Dave F" but here is an additive..... Having worked at a Lab for testing Soaponifiers, cleanliness, and contamination when a customer says "we had a lab check it and its clean" scares the bejesus outta me and I equate it to a used car salesman "Have I got a deal for you" or even more relavant an internet salesman "Have I got a Dot Com for you"...OK OK maybe not that bad but the effect is the same "DO YOU BELEIVE IT" Have it retested. We have had customer tell us it is clean only to find out they used street

Misprint PCB Cleaning

Aug 6, 2001 | Misprint PCB Cleaning epoxy dictates the chemistry's effectiveness. You are more subject to operator issues but we all know those concerns. It's a balancing act. Ultrasonic cleaning is likely to be your better approach. You should test chemistries before just throwing a cleaner into your facility. I'll be honest, I

Warp PCBA- how to repair ** Question #2

Jul 16, 2001 | You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=358 IPC TP-1115 �Selection & Implementation Strategy for A Low-Residue No-Clean Process�

Test vehicle for PWA cleaning

Jun 26, 2001 | Test vehicle for PWA cleaning on a break-away tab to most boards. If you know that your board fabricator runs a clean shop, this might be something to ponder.

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