stencil cleaning

"stencil cleaning" search results in the Electronics Forums

9777 result s found for "stencil cleaning" in the Electronics Forums

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HTI Screen Printer

Oct 11, 2012 | better, a manual) on HTI printers? So far, I've managed to energize the system, and get the air going. I can lift the stencil head, and have the table moving. The other day, the table would shuttle in and out of the print area, but the squeegee arm wouldn't move. Today, I managed to get the table

Auto stencil printer or AOI

May 16, 2012 | CS-400C: As with anything, once you are up on the learning curve its really not that bad. The "E" ma

Entry-Level PnP + BGA?

May 5, 2012 | to tell here in the forum, but I highly recommend Essemtec over Manncorp. Although I must admit that the new vision systems on the Manncorp machines is interesting. I use a manual stencil printer, the LPKF ProtoPrint S, which can hold a 12" x 17" cast frame. Don't waste your time with a clam-shell style

Entry-Level PnP + BGA?

May 4, 2012 | , stencil through reflow. From what I've read in the forums, buying new is recommended in order to establish the supplier relationship and gain training and support. At our price-point, however, Manncorp and Essemtec seem to be the only options. Here's the trick: our first project out of the gate

How to choose a new solder paste

May 26, 2011 | I agree with Dave on the processing issues, but there are others: Print speed capability (do you get good deposits at various print speeds), humidity exposure (our plant did get to the high side so moisture absorption on the board/stencil was an issue), delay time (how long can the paste sit

Nub bying p&p, stencil printer and reflow.

Apr 15, 2011 | agree, if you have fine pitch components the placement rate will be much less of what you see in the

BGA Placement Process

Apr 5, 2010 | Hello Bob, What makes this problem even harder for us is that we are not the manufacturer of this particular board. We are just performing re-works on them based on the issues they come in for, and thus refurbishing the unit. We are currently in the process of ordering the stencils for this BGA

AOI for solder inspection

Nov 19, 2009 | Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are called at your place. So you have to invest, IC

Researching placement machines - where do I start?!

Nov 5, 2009 | Before you buy a manual screen printer try to do it by hand. We hand stenciled boards with 19mil pitch parts for three years with decent results, with your parts it should be simple. lay the board on a piece of ESD bubblewrap, the kind with small bubbles, and lay the stancil over it, either buy a

Vapour phase soldering - problem

Aug 18, 2009 | Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process in theory, however in practice this tomb

Electrically-Conductive Tapes application advice?

Aug 1, 2009 | probably, the PCB will be low volume(<100) so it should be ok to do manual on all boards. It's just that i had to keep the solder protrusion/electrical connection as low profile as possible(<1mm high). I will try controlling the stencil thickness you mentioned. And also the adhesive tape method which

Misalignment Brainstorm - Fiducials On Board VS On Breakaway Tab

Apr 30, 2009 | from point A to point A on two adjacent PCBs). Although if you're stencil print doesn't have the same offset and your P&P program is using the same pitch, this wouldn't be your problem. Good Luck.

0402 tombstoning and dewetting on QFP256 trade-off

Mar 6, 2009 | -and-Soldering:-Reviewing-the-Issue-of-Inerting/ Third, on setting up a printer: * Set the down-stop to default * Start with pressure of about 1 pound/inch of blade. * Adjust the pressure up/down to leave a very thin film on the stencil. * Speed should match your paste, (slower speeds wipe cleaner)

High complex board manufacturing

Mar 3, 2009 | during Reflow are also shall cause for HiP. 3. Printing: Print M/A with >25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role

Quick Turn Around for an EMS Provider - Brainstorming

Jan 19, 2009 | releases it to the PCB fab. This will give you enough time to get the stencil. Do NOT extract component locations from Gerber. If a customer cannot provide proper component location data from his PCB layout system, he doesn't deserve fast service. Ask for the partial kit at the same time the PCB fab

What will happen if a sloder paste is used after 24hours

Jan 18, 2009 | small disk [around 4-5mm diameter and 0.2mm thick - a business card with a hole from a standard paper hole punch makes a good stencil] of paste onto a non-wettable substrate [eg, glass microscope slide, solder mask on board, ceramic tile], and re-flow as normal. A single solder ball in a clear pool

Quick Turn Around for an EMS Provider - Brainstorming

Jan 12, 2009 | processes in my mind that are currently done: Incoming Inspection and Labelling Gerber Data extraction of CAD Stencil Design and Ordering (1 Day) Generation of Assembly Documents (Visual for SMT and THA) Machine Programming and Thermal Profile Preparation Stores Kit Preparation SMT Set-up and THA Set

BGA failure at Functional Test

Jan 7, 2009 | . of failure boards passed after re-reflow and rest of them had to change or replace BGA in order to pass at FCT. Same assembly we ran couple of times and never had this issue only last time this happend. we havent change the profile, paste(Kester R562), stencil, SMT line. profile for this board is very good

AOI Inspection equipment for populated PCB's

Dec 18, 2008 | , with poor solder etc and you can use this as feedback to update your stencil ommron have patent on this lighting and all other pretend they have the same, but they dont as even if they have different color lighting it's not on different angles and do not allow this 3d imaging the programming is not so

smt machine of fuji machine nxtII

Oct 3, 2008 | stencil printer, but there was no word if it will do the larger prints for the larger machine they were showing, so that's a bit odd. Also, on the MYDATA booth they had a cool vertical storage for reels of components. It's a dry cabinet, but you can request a component and it auto fetches it for you

Electro-mechanical assembly specification?

Sep 2, 2008 | there are standards for the macines. For Europe there is CE mark. This one requires various tests of your equipment to show match of safety requirments(el and mechanical). For macine accuracy (pick and place machine or stencil printers) there are IPC standard(6850 - not hundred percent sure about the number

Solder balls

Jul 17, 2008 | & Corrective Action 2a SMT Process Related 2a1 Too much solder on pads * Decrease stencil thickness * Decrease aperture size 2b Equipment Process Related 2b1 Solder splash into pot rebounding onto board * Adjust anti-splash gates 2b2 Insufficient Activator * Increase conveyor speed * Increase flux

CCGA solderability criteria

Jun 21, 2008 | ) stencil thickness for all of our boards, with or without the CCGA:s and we don't have any issues with CCGA from 684 to 1680 columns. We produce both RoHS and non RoHS. The solder joints are never as shiny and pure with no_lead soldering compare to leaded process, yet still ok. Make sure that you temp

Vapor (vapour) Phase?

Jun 15, 2008 | solder incredibly large objects right next to small devices, and it equals out due to the process itself. However the big problem we had was we just kept getting tomb-stoning, and no matter what we did we just could not get rid if to. We tried all kinds of stencil designs' and it just kept happening

Small batch Manufacturing

Dec 21, 2007 | > All or nothing You do not need to purchase everything all at once. You can start with the manual stencil printer and oven, which are the lower cost items and easiest to maintain. Placing parts by hand will be very time consuming, but you can do a few jobs while you are looking for the "right

Pasting a thru-hole part at SMT

Dec 5, 2007 | (RA)=(��)(L/2)(L/2)-(��)(H/2)(H/2) Required solder volume (SV)=HV-LV "Required Print Volume (PV)=(2)(SV) (50%) " Required Print Area (PA)=(F)(PV)/stencil thickness F=Inspection Factor .7=no fillet .9=fillet on both sider 0.8=fillet on primary side 1.0=large fillet on both sides Note: Must consider the solder

Need Philips CSM84 PA1306/20 service manual

May 24, 2007 | for the MA station, it placed a .65mm pitch 144-pin TQFP very well. I eyeballed the chips before the reflow, all of them were dead on before reflow, but some drifted a bit during. I am making my own solder stencils, and am still getting the hang of tweaking the apertures for specific component types. I

solder paste measurement machine

Apr 27, 2007 | volume. I seriously doubt you would find any different between the volume of paste on an aperture from the 1st print compared to the 1 millionth print. Stencil just don�t wear out that quickly. So running complicated SPC generating software programs is generally a waste of time. The 2nd thing we

LGA36 6.5 x 3.5 mm

Apr 5, 2007 | Thanks all, We have now done the first protype run with the new stencil square 0.35mm apertures and my first impression is that it works, as far as no bridging on any pad on the component > to pad on the PCB. The pick & placement as I mentioned before is OK. Now our X-Ray machine cannot see

LGA36 6.5 x 3.5 mm

Mar 23, 2007 | and the pitch 0.6mm Ni/Au We have just ordered the stencil with 8% reduction of the pad size off the pcb and 0.127mm thicknes. I can already see some problems in front of me; the operators will have a difficulty to do their visual inspection to determine if the placement is ok befofore send the boards

i want to know what i need to made a manufacturing line for smt

Mar 15, 2007 | Hi, If your doing a line, then your going to need more than the simple prototyping machines listed above in this thread. (Although they are cool ideas, and loved the toaster oven modification guy, and the other guy soldering ic's with it too!) We are using a DEK stencil printer, 4 XP series Fuji

Skewed components

Mar 9, 2007 | the area to 65-75% 2. Use a 0.127mm stencil thickness (It will work on the product you describe). 3. If You have the oppurtunity to send "constructive" feedback to the customer of yours, whitout them going mad; then tell them to make the cooling pad less in length starting from the back. Of course tell

BGA adapter boad?

Jan 5, 2007 | was tested it could be placed on the mother board like a large BGA but with paste only-no balls. I think this can be accomplished with a 6mil stencil. If we use the outline of a large PLCC we can use old matrix trays to present the part to the machine. Has anyone ever tried anything like this? It seems like

Yield on 0402 SMT Printed Circuit Board Assemblies

Jan 4, 2007 | problems were with 0603 caps that didn't work with our minimelf capable nozzles. With good placement you should be able to achieve that as well. If your problems are mostly print based maybe a stencil design review is in order to go along with your new equipment? I know I had to use a different set

Streaking at Screen Printing

Dec 15, 2006 | . The problem is after say about 20 prints I begin to get a build up of what looks like a metal on the blades which is the solder paste but it is become a harder solder ball and some what shiney. What this does is cause streaking where it is on the blade keeping the blade from contacting the stencil evenly. We

UBLOX Tim-4A reflow problem

Dec 8, 2006 | pushed up by the paste when it goes to liquid. Other joints almost look like a BGA sitting on top of a ball. Initially we thought it was due to the pcb bowing in the oven and had some fixtures made to fix that . It didn't. Using 1:1 stencil without the recommended 0.2mm overprint. Have tried both 0

hot air rework station / solder paste

Nov 17, 2006 | I'm in North Attleboro, small world. To answer your question, you can deposit small dots of paste with a syringe. Kind of tricky work, and there are small stencil soluions out there fairly inexpensively. See


Sep 5, 2006 | I have a lot of experience on 1995 vintage Dek 248 and Dek 249. The 1995 to 1997 vintage were not t

soldering to thick gold plating

Jul 12, 2006 | more gold into the solder joint and gold embrittle the solder joint even more. If you print more solder paste or increase your stencil thinkness, your solder joints will look better. This is because you decrease the gold content dissolved into the 63/37 paste by increasing the 63/37 volume

Oop's Pb BGA's in a RoHS process?

Jun 20, 2006 | Electronics%20Assembly.pdf To be on the safe-side and to eliminate the "reliability" question mark, I would block out stencil apertures on the Pb BGA device, and manually apply tacky flux before pick-and place. The hotter Pb-Free temps. should be fine to collapse your Sn-Pb ball. The main concern

Need help for setting up an assembly line

Jun 19, 2006 | like to ask for advices from your expertise. Any advice or comment is greatly appreciated. 1. Manual solder paste stencil printer (AIC Technology SSP-75A) 2. SMT 2350C Pick & Place 3. 1088 Heller Reflow 4. PCB Wash & Cleaner (Aqueous CL400 or Lancer 1300PCB) 5. Temperature Oven (Blue M or similar

Paste in hole (state of the art)

Feb 17, 2006 | , pad layout & stencil design. Ds

SMT tape boards!

Oct 26, 2005 | high volume board where the data is still suspect after being run through our front end. There is only so much you can dictate to a customer on what you want from them - some offer too much, sometimes based on innaccuracies in the past (stencil thickness'with no blade type spec'd, types of solder paste

Viscosity Solder Paste for SMT Production

Aug 22, 2005 | Generation in Stencil Printing Affects Solder Joint Quality" MHA Riedlin and NN Ekere; Surface Mount Technology (SMT) August 1999]

01005 (0402 in metric unit) printing accuracy

Jul 20, 2005 | , PWB design and fabrication, condition of solderpaste, proper formulation of solderpaste, properly designed and maintained stencil. Industry leaders in printers MPM and DEK may be on-the-job already doing print studies for 01005 chips and can supply you with papers on 0201-chip printing. Be careful

Need help on selecting the SMT equipment for small volume

Jul 14, 2005 | stencil printer, MC383N-L20V P&P, and 330 Convection reflow Oven. Should I consider to use MC390V2-V P&P and 545 lead-free reflow? http://www.manncorp

Stencil thickness

Jun 9, 2005 | I would suggest 7mm thick "Durostone" as a carrier material. Cut lip/pocket for PCB so it is 0.05"

New SMT line - P&P equipment selection help

Jun 2, 2005 | on a cheaper machine to add up in rework and component costs. So I think the advice is to spend everything you have on placers and stencil printers, as that's where the quality of the line comes from. Regards, Grant

Problems with .45 mil ball diameter BGA....

Apr 27, 2005 | Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is only .45mils, then your solder paste height

Solder in via holes causing printing problems

Jan 6, 2005 | nodule that prevents the stencil from forming a gasket on the board, making it impossible to print. What causes the solder to be trapped inside the via holes on some boards and not on others? Does the thicker board have something to do with it? Does it have something to do with the soldermask design

Defluxing Advanced Packages

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