stencil cleaning

"stencil cleaning" search results in the Electronics Forums



9777 result s found for "stencil cleaning" in the Electronics Forums

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Help required selecting reflow oven

Jun 27, 2019 | Hi, I have a small assembly line that consists of a Semi-Automatic Stencil machine, a Samsung Pick and Place, a small IR reflow oven and a wave soldering machine. The reflow oven is presenting the biggest bottleneck. The machine is a small IR (T960) machine is a 5-zone that has 3 heaters above

Please Help: Pace TF 1800 or Finetech CorePlus

Apr 2, 2019 | capability but we used stencils that allowed you to apply paste to the BGA solder balls themselves. It also has a really cool underside heater that can be adjusted so that it gets much closer to the bottom of a pc board, which makes it easier to reflow tough massive boards. I believe it has 0201 placement

Compact Reflow Ovens?

Mar 19, 2018 | Another critical part of a process with a large board is support. Most commonly this is a bed of pins e.g something like red-e-set but there are other solutions. Support with a large panel will be critical for printing to get a good gasket between PCB and stencil and fairly important during

Programming for Pick & Place and AOI machines

Aug 1, 2017 | Another commercial tool is Valor MSS Process Preparation from Mentor-Siemens (Valor), can handle Gerber, PnP, ODB++, Native CAD ASCII Files, BOM and CAD Merge, SMT Pn Programming, AOI exports , DFT Engineering - ICT/Flying Probe programming, Stencil Engineering , Documentation and Manual Assembly

Dry solder

Jan 9, 2017 | into the PCB. 2.Alternat component part used. 3.Stencil aperture opening increased to increase paste volume. We suspect the pin to hole ratio in respective component location and details is, component lead dia - 0.45mm and PCB hole dia - 0.7mm and the variants is 0.25mm. So kindly help to provide the standard

Wave soldering pallet

Dec 7, 2016 | Does your new machine require the use of pallets? Some do not. If so, consider these suppliers to help with your pallet: * Asahitec stencils pvt ltd [http://www.smtnet

AOI Machine Daily Verification

Jan 11, 2016 | You can do the so called "Golden Sample" with defects from the process. The making of the defects on the board is very important to be as much close to the real ones from the production. How I do it - after the printer I remove paste on some pads, so I can simulate missing solder (blocked stencil

DPAK's sliding off pad during reflow

Aug 13, 2015 | to the part causes the part to shift in position. You can control these by several means. My first recommendation is to examine the part's corresponding pads on the PCB as well as the solder paste aperture's on the stencil. Check to see that they follow the part manufacturer's recommendations. You can also

Aegis Factory Logix

Jun 11, 2015 | Valor MSS NPI is far more powerful than all the lower cost solutions, I had customer assess all their lower cost solutions and found no real added value, if want more than just SMT programming. NPI needs Stencil Optimisation , DFM analysis, DFT engineering and other value add....SMT is just one

Printer and Reflow Oven Recommendations

May 13, 2015 | that are reliable and easy to use. It is important to maintain a high-level of quality for our finished products while lowering overall operating costs. What reflow oven and stencil printer would you recommend and why?

BGA Pad with Irregular Pad size

Sep 5, 2014 | ) Stencil apperture size 0.2 mm (as per gerber size) My questions are, 1. What is the effect of small BGA Pad on the PCBA? Currently we have high rejection rate for this PCBA, but we cannot find (yet) it's correlation to the BGA. 2. Will there'll be reliability issue due to this? I'm thinking due

What is a typical SMT placement defect rate?

Jul 17, 2014 | of solder joints might be much higher (SIMILAR for example) to the number of solder aperatures in your stencil for SMT only board (10 14pin SOIC IC's) One NO solder joint stops 1 board in 100 from working. This is one non functioning part in 100 parts placed This is ONE solder defect in 14000 possible

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Apr 14, 2014 | to design for automated SMT production. So I thought I'd get some advice here about the advisability / likelihood of success of combining the two footprints. My thought was to make a composite pad the shape of the two pads overlaid, but have separate stencils, applying solder paste only for the particular

Pick and place machine for small productions. Any suggestions?

Sep 19, 2013 | We have already one desktop oven and a manual stencil printer. And we have a quite complete soldering bench with several JBC tools. We also have stock for all active elements we use. We normally relay on the PCB assembler to provide the passive components, and that's very little money. In general

Problem with a MPM HiE

Jun 1, 2013 | logo on the bottom left of the screen) the board stops could be taught in several ways. In the older systems with the board stop sensor in the worknest the position is fixed and you use detent to center or offset the PCB for course stencil alignment. In the newer systems the board stop sensor

HTI Screen Printer

Oct 11, 2012 | better, a manual) on HTI printers? So far, I've managed to energize the system, and get the air going. I can lift the stencil head, and have the table moving. The other day, the table would shuttle in and out of the print area, but the squeegee arm wouldn't move. Today, I managed to get the table

Auto stencil printer or AOI

May 16, 2012 | CS-400C: As with anything, once you are up on the learning curve its really not that bad. The "E" ma

Entry-Level PnP + BGA?

May 5, 2012 | to tell here in the forum, but I highly recommend Essemtec over Manncorp. Although I must admit that the new vision systems on the Manncorp machines is interesting. I use a manual stencil printer, the LPKF ProtoPrint S, which can hold a 12" x 17" cast frame. Don't waste your time with a clam-shell style

Entry-Level PnP + BGA?

May 4, 2012 | , stencil through reflow. From what I've read in the forums, buying new is recommended in order to establish the supplier relationship and gain training and support. At our price-point, however, Manncorp and Essemtec seem to be the only options. Here's the trick: our first project out of the gate

How to choose a new solder paste

May 26, 2011 | I agree with Dave on the processing issues, but there are others: Print speed capability (do you get good deposits at various print speeds), humidity exposure (our plant did get to the high side so moisture absorption on the board/stencil was an issue), delay time (how long can the paste sit

Nub bying p&p, stencil printer and reflow.

Apr 15, 2011 | agree, if you have fine pitch components the placement rate will be much less of what you see in the

BGA Placement Process

Apr 5, 2010 | Hello Bob, What makes this problem even harder for us is that we are not the manufacturer of this particular board. We are just performing re-works on them based on the issues they come in for, and thus refurbishing the unit. We are currently in the process of ordering the stencils for this BGA

AOI for solder inspection

Nov 19, 2009 | Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are called at your place. So you have to invest, IC

Researching placement machines - where do I start?!

Nov 5, 2009 | Before you buy a manual screen printer try to do it by hand. We hand stenciled boards with 19mil pitch parts for three years with decent results, with your parts it should be simple. lay the board on a piece of ESD bubblewrap, the kind with small bubbles, and lay the stancil over it, either buy a

Vapour phase soldering - problem

Aug 18, 2009 | Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process in theory, however in practice this tomb

Electrically-Conductive Tapes application advice?

Aug 1, 2009 | probably, the PCB will be low volume(<100) so it should be ok to do manual on all boards. It's just that i had to keep the solder protrusion/electrical connection as low profile as possible(<1mm high). I will try controlling the stencil thickness you mentioned. And also the adhesive tape method which

Misalignment Brainstorm - Fiducials On Board VS On Breakaway Tab

Apr 30, 2009 | from point A to point A on two adjacent PCBs). Although if you're stencil print doesn't have the same offset and your P&P program is using the same pitch, this wouldn't be your problem. Good Luck.

0402 tombstoning and dewetting on QFP256 trade-off

Mar 6, 2009 | -and-Soldering:-Reviewing-the-Issue-of-Inerting/ Third, on setting up a printer: * Set the down-stop to default * Start with pressure of about 1 pound/inch of blade. * Adjust the pressure up/down to leave a very thin film on the stencil. * Speed should match your paste, (slower speeds wipe cleaner)

High complex board manufacturing

Mar 3, 2009 | during Reflow are also shall cause for HiP. 3. Printing: Print M/A with >25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role

Quick Turn Around for an EMS Provider - Brainstorming

Jan 19, 2009 | releases it to the PCB fab. This will give you enough time to get the stencil. Do NOT extract component locations from Gerber. If a customer cannot provide proper component location data from his PCB layout system, he doesn't deserve fast service. Ask for the partial kit at the same time the PCB fab

What will happen if a sloder paste is used after 24hours

Jan 18, 2009 | small disk [around 4-5mm diameter and 0.2mm thick - a business card with a hole from a standard paper hole punch makes a good stencil] of paste onto a non-wettable substrate [eg, glass microscope slide, solder mask on board, ceramic tile], and re-flow as normal. A single solder ball in a clear pool

Quick Turn Around for an EMS Provider - Brainstorming

Jan 12, 2009 | processes in my mind that are currently done: Incoming Inspection and Labelling Gerber Data extraction of CAD Stencil Design and Ordering (1 Day) Generation of Assembly Documents (Visual for SMT and THA) Machine Programming and Thermal Profile Preparation Stores Kit Preparation SMT Set-up and THA Set

BGA failure at Functional Test

Jan 7, 2009 | . of failure boards passed after re-reflow and rest of them had to change or replace BGA in order to pass at FCT. Same assembly we ran couple of times and never had this issue only last time this happend. we havent change the profile, paste(Kester R562), stencil, SMT line. profile for this board is very good

AOI Inspection equipment for populated PCB's

Dec 18, 2008 | , with poor solder etc and you can use this as feedback to update your stencil ommron have patent on this lighting and all other pretend they have the same, but they dont as even if they have different color lighting it's not on different angles and do not allow this 3d imaging the programming is not so

smt machine of fuji machine nxtII

Oct 3, 2008 | stencil printer, but there was no word if it will do the larger prints for the larger machine they were showing, so that's a bit odd. Also, on the MYDATA booth they had a cool vertical storage for reels of components. It's a dry cabinet, but you can request a component and it auto fetches it for you

Electro-mechanical assembly specification?

Sep 2, 2008 | there are standards for the macines. For Europe there is CE mark. This one requires various tests of your equipment to show match of safety requirments(el and mechanical). For macine accuracy (pick and place machine or stencil printers) there are IPC standard(6850 - not hundred percent sure about the number

Solder balls

Jul 17, 2008 | & Corrective Action 2a SMT Process Related 2a1 Too much solder on pads * Decrease stencil thickness * Decrease aperture size 2b Equipment Process Related 2b1 Solder splash into pot rebounding onto board * Adjust anti-splash gates 2b2 Insufficient Activator * Increase conveyor speed * Increase flux

CCGA solderability criteria

Jun 21, 2008 | ) stencil thickness for all of our boards, with or without the CCGA:s and we don't have any issues with CCGA from 684 to 1680 columns. We produce both RoHS and non RoHS. The solder joints are never as shiny and pure with no_lead soldering compare to leaded process, yet still ok. Make sure that you temp

Vapor (vapour) Phase?

Jun 15, 2008 | solder incredibly large objects right next to small devices, and it equals out due to the process itself. However the big problem we had was we just kept getting tomb-stoning, and no matter what we did we just could not get rid if to. We tried all kinds of stencil designs' and it just kept happening

Small batch Manufacturing

Dec 21, 2007 | > All or nothing You do not need to purchase everything all at once. You can start with the manual stencil printer and oven, which are the lower cost items and easiest to maintain. Placing parts by hand will be very time consuming, but you can do a few jobs while you are looking for the "right

Pasting a thru-hole part at SMT

Dec 5, 2007 | (RA)=(��)(L/2)(L/2)-(��)(H/2)(H/2) Required solder volume (SV)=HV-LV "Required Print Volume (PV)=(2)(SV) (50%) " Required Print Area (PA)=(F)(PV)/stencil thickness F=Inspection Factor .7=no fillet .9=fillet on both sider 0.8=fillet on primary side 1.0=large fillet on both sides Note: Must consider the solder

Need Philips CSM84 PA1306/20 service manual

May 24, 2007 | for the MA station, it placed a .65mm pitch 144-pin TQFP very well. I eyeballed the chips before the reflow, all of them were dead on before reflow, but some drifted a bit during. I am making my own solder stencils, and am still getting the hang of tweaking the apertures for specific component types. I

solder paste measurement machine

Apr 27, 2007 | volume. I seriously doubt you would find any different between the volume of paste on an aperture from the 1st print compared to the 1 millionth print. Stencil just don�t wear out that quickly. So running complicated SPC generating software programs is generally a waste of time. The 2nd thing we

LGA36 6.5 x 3.5 mm

Apr 5, 2007 | Thanks all, We have now done the first protype run with the new stencil square 0.35mm apertures and my first impression is that it works, as far as no bridging on any pad on the component > to pad on the PCB. The pick & placement as I mentioned before is OK. Now our X-Ray machine cannot see

LGA36 6.5 x 3.5 mm

Mar 23, 2007 | and the pitch 0.6mm Ni/Au We have just ordered the stencil with 8% reduction of the pad size off the pcb and 0.127mm thicknes. I can already see some problems in front of me; the operators will have a difficulty to do their visual inspection to determine if the placement is ok befofore send the boards

i want to know what i need to made a manufacturing line for smt

Mar 15, 2007 | Hi, If your doing a line, then your going to need more than the simple prototyping machines listed above in this thread. (Although they are cool ideas, and loved the toaster oven modification guy, and the other guy soldering ic's with it too!) We are using a DEK stencil printer, 4 XP series Fuji

Skewed components

Mar 9, 2007 | the area to 65-75% 2. Use a 0.127mm stencil thickness (It will work on the product you describe). 3. If You have the oppurtunity to send "constructive" feedback to the customer of yours, whitout them going mad; then tell them to make the cooling pad less in length starting from the back. Of course tell

BGA adapter boad?

Jan 5, 2007 | was tested it could be placed on the mother board like a large BGA but with paste only-no balls. I think this can be accomplished with a 6mil stencil. If we use the outline of a large PLCC we can use old matrix trays to present the part to the machine. Has anyone ever tried anything like this? It seems like

Yield on 0402 SMT Printed Circuit Board Assemblies

Jan 4, 2007 | problems were with 0603 caps that didn't work with our minimelf capable nozzles. With good placement you should be able to achieve that as well. If your problems are mostly print based maybe a stencil design review is in order to go along with your new equipment? I know I had to use a different set

Streaking at Screen Printing

Dec 15, 2006 | . The problem is after say about 20 prints I begin to get a build up of what looks like a metal on the blades which is the solder paste but it is become a harder solder ball and some what shiney. What this does is cause streaking where it is on the blade keeping the blade from contacting the stencil evenly. We

Defluxing Advanced Packages

Capillary Underfill process