stencil cleaning

"stencil cleaning" search results in the Electronics Forums

9814 result s found for "stencil cleaning" in the Electronics Forums

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Rheometric Pump - Yes or No???

Jun 27, 2005 | dams and clean out about 4 inches of the chamber. Take a look in along the chamber at a cross section of the solder paste bead. The paste at the back of the chamber (furthest away from screen) will be noticeably drier. If any of this stuff gets pulled around to the blades then it cannot fill


May 28, 2005 | . It was listed as a service Bulletin. This was of course omitted on newer machines. 5. Possible bad or dirty Photo sensor. Test accordingly through I/O. Clean and or replace. Best of Luck, Mike


May 24, 2005 | Institute represents the fuel preparation and clean burning technology of renewable biomass energy sources and is dedicated to the advancement and promotion of the fiber and densified (pellets) fuel technology that will help solve global ecological problems through the utilization of locally renewable

Lead-Free SMD repair

May 3, 2005 | use a custom nozzle to reflow the board and this is a skilled art more than a science when done by hand. For solder sucking I used a Metcal although it needed a lot of attention to keep it clean and operating. We sell a rework station with a lot of these features and a PC that learns the thermal

Gold versus HASL finish

Mar 15, 2005 | of your process temp. window. Also, aggressive fluxes will assist the cleaning and promote wetting on Ni. However, if you have good wetting spread on the gold you're probably ok (temp wise). If you have a single homogenous solder mass, you're probably ok. But, again, the profile can not be rulled out.

Ionograph or Omegameter

Nov 1, 2004 | have optimized your process (including incoming inspection, quality control, storage, handling, etc.), send samples to the lab, while at the same time running duplicates on your ROSE tester. When the IC shows that everything is clean except for the weak organic acid from the low residue flux

Coating adhesion problems

Sep 21, 2004 | . For instance, a semi matte finish on solder mask has more surface free energy than a glossy finish. Q3: What is the purpose of baking the board after cleaning with IPA and before coating? A3: We�re thinking than maybe the water from the IPA is interfering with proper adhesion of the coating. Q4: Does dewet

Palladium Silver surface finish

Aug 24, 2004 | is that the solder paste flux that you utilize should have the highest activity that you can get from your vendor whether it be no-clean or water wash, also when using the lead -free paste sticking with the strickly tin, silver 96.5/3.5 sn/ag eutectic helps quite a bit. Most importantly the reflow profile should

Solder pot contamination

Aug 9, 2004 | ). I have a dual flux wave. The biggest problem is keeping the fingers clean and the grease in good shape.

Crystalized Flux under BGA

Aug 6, 2004 | Thanks for providing the pictures. We evaluated what we could see and have the following idea's. 1) Because of different thermal charatoristics between the topline and your product, your Motorola BGA solder joints may have experienced a higher reflow temperature. Therefore, a cleaning process

BGA open joint

Aug 6, 2004 | and lowering the strain rate would have eliminated the problem also. The in-circuit test engineers wouldn't let us reduce the strain rate because they said the probes wouldn't be able to break through the flux (test was before clean in this case). We don't see the same failure mechanism on OSP or HASL boards

Crystalized Flux under BGA

Aug 4, 2004 | Additionally, increases in temperature can increase the water's rate of reaction with the flux. Sometimes, only a 5 degree change can make the cleaning difference. If the flux inconsistently presents itself, then the likely cause is something in the system which is varying. If temperature

Wavesolder PCBs encounter pinholes

Jul 21, 2004 | carbon is conductive the plating is incomplete. A simple way to identify an outgassing problem is to re-heat the defective solderjoint with a soldering iron and watch the bubbling effect when the solder solidifies. Is your flux water-based or alcohol based and do you have solderballing before cleaning

Pb-Free wave Soldering - With or Without N2 ?

May 17, 2004 | I disagree about the maintenance issues with tin/copper solder. All high tin content solders are hard on machines (silver or not). More dross? Controlling the back flow, front flow velocity and AVOID constant surface cleaning will reduce your dross production (lead or lead-free). Also, only use

Reference Standard for Plasma Etching or Scrubbing on Flex Ckts

May 14, 2004 | I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptable value of 10.6 max. The flex circuit is dipped

Wave soldering profiling

Apr 14, 2004 | Frank, Your initial question about temperature profiling is a critical point to a good wave solder process. Especially if you have a No Clean flux. As recommended by many in the thread above, get the Process Data Sheet for your flux (this is not the MSDS). There will be a recommendation range

No Lead BGA Hot Gas Rework

Apr 12, 2004 | . We have no problem removing the Bad BGA and cleaning the pad. Even after installing the new pb free BGA on the site the x-ray looks great and SEM pictures show very good joint properties. My issue is joint reliability. I just can not justify running the reflow profile above 217C to 220C just because

Cleaning Water Soluble Flux under BGA's

Mar 25, 2004 | Hi Dave As usual we always enjoy your resourceful & informative responses. We miss Mike and others

Cleaning Water Soluble Flux under BGA's

Mar 24, 2004 | Dreamy It sounds like you are having fun in your new job. Saponifier. Alkaline chemicals, add

No-clean reflow profile

Mar 24, 2004 | Hi Steve My name is Marc Apell, I work for Speedline Technologies. I checked out the Aim web s

fiducial mark

Mar 2, 2004 | To clean up other replys I will add that some most all machines have global correction. Most placements are an off sets from pcb 0,0 usually the lower left corner of the board. When the machine locates the fiduitals and these fids are not exactly where the data indicates they are it will make

Aqueous Technologies SMT800-LD Software Question

Feb 4, 2004 | 't change them, or so I was told by Aqueous Technologies when I called and asked the question. The manual didn't explain how to change them, so that's why I called. But the manual does publish the passwords that are in the machine...they're "Super", and "Clean". So if anyone reads the manual (which is what

Post reflow solder joint inspection

Feb 2, 2004 | solving conference call). He insisted we had unreflowed solder on 1 pilot board. He detemined this from 2 emailed digital photos (that I took). Then he went on to suggest I swithch from a no clean over to a low solids RMA flux type. Can someone eplain to me how a low solids flux type will solve (an

siplace part missing

Dec 13, 2003 | the machine and clean them entirely.

Vapour Degreasing

Dec 2, 2003 | Adam- I would touch base with the three people I have listed below. Touching base with each one will net you every thing about Vapor Cleaning Equipment you would ever want to know. Ultronix Carl Wolf 800-553-7881

PCB wash chlorine

Oct 2, 2003 | Who says the chlorine comes from your tap water? Our PTOW dumps boat loads of chlorine into our water periodically. Sometimes it's so bad you can smell it. We doubt that it is the source of your problem. This chlorine will volitize very quickly, be cleaned by your carbon bed, and probably

Mydata Package Database hints?

Oct 1, 2003 | similar or identical package already in the system somewhere, under a strange name. I have cleaned out a lot of the redundant packages that were under different names using Mydata's web interface and database search functions, but there are several thousand defined Packages in our system. Verifying each


Sep 18, 2003 | the stock 4" diameter arrangement. The nitrogen oven is specified at 150cfm for both entrance and exit exhaust ports. The air cooled oven is 150cfm at the entrance and 300cfm at the exit exhaust. This bias towards the exit side of the oven helps to keep it clean even in a high volume environment

Black pad defect on gold plated boards

Aug 21, 2003 | it must have been contaminated some how in our facility. We cleaned up the joints as best we could and shipped it since it was just a prototype. Electrically, the boards worked fine but the engineer removed an so-8 to try another part and the pads would not accept solder. I can not imagine


Jul 18, 2003 | If you are saying that you have discolored white tin at in-bound inspection, you have bad boards. T

Porosity in Good Plating

Jul 4, 2003 | if your board is bending during assembly. To avoid moisture condensing & creating shot/reistance,You need to have a conformal coating on the soldered leads. Clean the Boards throughly in an ultrasonic cleaner and see the sodlered pads under a high zoom microscope to see if it is surrounded with solder

Thermo-couple attachment

May 7, 2003 | to remove this material cleanly, without damaging the board or component. � Quick curing epoxies like "5 minute" epoxy are rated in the range of 130�C, so they often pop off during reflow.

Whitish Solder Joint

Apr 4, 2003 | the boards to a contract shop for cleaning and testing to assure that their boards absolutely immaculate. Q4: What takes precedence to IPC-A-610C, 6.1 or 7.3? A4: Neither takes precidence. White residues are unacceptable, because they indicate a process that�s not well controlled.

Whitish Solder Joint

Apr 4, 2003 | we recently detected white colour solder joints, across the whole board. we tried to clean with IPA but without effective return of solder joint to shiny joints. Anyone has any ideas on how this post-SMT reflow solder joint could have changed to whitish joint? we use water souble paste with Aqueous

Immersion Gold over Nickle de-wetting problem

Mar 7, 2003 | and cross-section will probably verify that the problem is there, not the gold. There are debates as to what causes this: poor cleaning prior to nickel, galvanic reaction, poor initiation of the nickel bath, problems with the activator (catalyst), static charge, and probably others. We've seen the same

tcm3000 miniature bearing servicing

Feb 14, 2003 | Hello, As an Ex-Sanyo engineer I agree with the previous reply. Use EP1 sparingly. You may find that the nozzle sleeves are scored when you remove them. This is from lack of cleaning. You can only buy the sleeve and bearing from sanyo which is a waste as the bearings (MSB) never wears. The cost

Black pad defect

Feb 11, 2003 | , it will not solder when the gold is dissolved away into the solder. In effect, the gold-contaminated solder may stick to some clean areas of the nickel. * Another possibility is the codeposition of carbon with the nickel, which is another contamination that could cause solder not to bond. The most prudent steps you

Wave Soldering - Icicling/Bridges

Jan 24, 2003 | I am not familiar with your flux but with no-cleans (which I use) the primary cause of icicling is the amount of flux solids left on the board prior to wave and how long the board is in the wave (2.5 to 3.5 seconds should be OK). The amount of flux solids left on the board prior to the wave can

Cleanliness test

Jan 3, 2003 | cleaning, of course). No issue with solvent penetration. 3) If the results are the same�all is well. (Assume, no or little contamination). 4) If the results are not the same (assuming more contamination detected on �lifted components� boards), then I am in trouble (double trouble) a. I am not washing well

Cleanliness test

Jan 2, 2003 | no or little contamination, you should rest assured that the board is clean. If a ROSE tester indicates a moderate level of contamination, then additional testing may be required to determine if the contamination was evenly distributed across the board of concentrated under a component. Because destructive

Type 4 & Type 5 Paste Control?

Nov 14, 2002 | during use? how about any cleaning (WS?) needs *hint: ionic contamination level verifications?*?

Fine Pitch QFP100 Solder Joint - Need Help!

Oct 30, 2002 | is just a shiny line between the pad and the lead bonding them together then the toe with a 25% solder rise. The side of the termination lead looked the same before and after reflow which i suspect to have oxidised. It seems like the flux did not activate and clean that area. Is it a sign of a bad joint

Cleaning Oxides from BGA's

Oct 18, 2002 | David- You are correct!!! DING DING DING!!!! Here is an overview from the ACI website: ACI offe

Gold plated board, with csp's and 0603 with no clean apetures

Sep 26, 2002 | Both you and a previous poster are correct. Grainy / shiney solder are not a good indicator of a pr

UltraSonic cleaning machine

Sep 23, 2002 | Actually I didn't really think it was that blatant. He has something that could solve the problem o

PCB's for oven profile testing

Aug 28, 2002 | that needed it. Disadvantages- Depending on the flux you use, you may have some cleaning to do afterwards. You need an operator with some mechanical aptitude and soldering knowledge to set up the right nozzle, adjust the board holder, etc. They are easy to operate once it's ready, but many operators

PCB's for oven profile testing

Aug 26, 2002 | components on the board, consider wave soldering the connectors to the board. * I sense that you are not telling us something. Do you want to come clean?

PCB manufacture

Aug 20, 2002 | => Dry Hot Air Solder Level: Preclean => Rinse => Flux Coat => Solder Coat => Hot Air Level => Cool => Soft Brush => Post Clean Rinse => Dry Look here http://www.epa

Indium No-clean and Inert Reflow oven (N2)

Aug 2, 2002 | interesting, not at all what we were told so yes lot's of contradictions comming from them, I have t

ESD Control Set-up

Jul 9, 2002 | that are safe and areas that are not safe. Conductive flooring without wax just cleaned and buffed for maintenance works well. Using multiple systems in multiple areas tends to confuse people. Using one standard method usualy works better because people will use it as routine and you will have less need

Defluxing Advanced Packages

Polymeric Workmanship PCB for Training