stencil cleaning

"stencil cleaning" search results in the Electronics Forums



9815 result s found for "stencil cleaning" in the Electronics Forums

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Is DEK USA gone

May 24, 2019 | from KPS. Tecnomatix: Siemens PLM – EM-Test Expert Software (also known as Tecnomatix Unicam FABmaster). Trek: Stoelting Cleaning Equipment, 502 Hwy. 67, Kiel, WI 53042 USA; P: 920-894-2293 / 800-558-5807 F: 920-894-7029 <a class=roll href="Cleaning Equipment, 502 Hwy. 67, Kiel, WI 53042 USA; P: 920-894-2293 / 800-558-5807 F: 920-894-7029 <

Pick & Place Machine Longevity

Jun 4, 2018 | small business might not be able to justify that, however what that service costs will vary between manufacturers. On our Essemtec machine, in house maintenance essentially boils down to keeping it clean, maybe changing a filter etc. The regional Essemtec trained engineer will come and service it when

SMT LINE CHOICE

Mar 19, 2018 | ; idea it takes a lot of $200 stencils to cover the > cost of adding and maintaining dispensing > system. > > 20" wide boards will probably be your > most limiting factor most large board variants > increase the length they can handle and stop at > 460mm wide. If you like IIneo

Thinking of Led lamp and resistor

Oct 28, 2016 | that I cleaned with acid with the proper circuit to have 14 series of 12 leds in parallels. My question is do I need to include resistors for safety let say a led in a series dies so it doesn't blow up the rest of the led in that series? Is it possible to put a resistor at the end of each series or I

small and good pick and place machine

Sep 5, 2013 | it’s crucial to have in-house manufacturing capability to meet small production needs. The basic tools for small-scale PCB assembly include a stencil printing machine, a pick and place machine, and a reflow oven. The pick and place machine is probably the most expensive among the three. The Neo

Entry-Level PnP + BGA?

Jul 28, 2013 | goal is to pay > around $120K for the entire line, stencil through > reflow. From what I've read in the forums, > buying new is recommended in order to establish > the supplier relationship and gain training and > support. At our price-point, however, Manncorp > and Essemtec is to pay > around $120K for the entire line, stencil through > reflow. From what I've read in the forums, > buying new is recommended in order to establish > the supplier relationship and gain training and > support. At our price-point, however, Manncorp > and Essemtec seem

Heller Heating Element

Nov 13, 2012 | the blower fan for blockage or buildup of flux residue. Also check the blower for bearing run out or play(our cold zone still ran but had 1/4 inch of side to side run out in the bearing when we replaced it last annual inspection/cleaning. The blower to be weary of are the Black panted metal can style motor

Black color solder wetting after reflow

Apr 29, 2011 | Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is to touch up the affected solder joint, and or SM

ultra low cost pick and place?

Jun 12, 2010 | to build these prototypes. Quite a learning experience: stainless-steel stencils (new), solder-paste stencil printers (new), automatic pick-and-place machines (new), reflow ovens (new), hot-air-soldering stations/pencils/guns (new), and so forth. Without a doubt, precise placement of BGAs, QFNs, CSPs

Unusual solderability issue

Apr 15, 2010 | . The second shop moved to a SMOIG process. Keeping the vias clear of SM to help the cleaning process after ENIG. So far we are seeing better results but recently we've hit a small patch of issues but these appear to be more like black pad not the exposed gold issue. 3. The third shop is struggling. What

CP642 Ballscrew Replacement

Jun 24, 2009 | of the ballscrew. 10. Remove the 4 bolts from ballscrew. 11. Position the x/y table at the rear and leftmost of the machine. 12. Get a position wherein you can pull-out the ballscrew from the machine. 13. After successfull pull-out. Remove the ballscrew from the bracket. 14. Remove the angular bearing. 15. Clean

Lead manufacturing to lead free transisition

Feb 21, 2007 | to be cleaned out. If you're completely converting to lead-free, this might be a more economical method than buying a new lead-free machine. 3. Board finish. We've experienced the best results from ENIG finishes. I haven't had a lot of luck with white-tin finishes to date. However, your mileage may vary

Soft Water Versus Deionized

Jan 27, 2007 | water may shorten the life of plumbing and lessen the effectiveness of certain cleaning agents. When hard water is heated, the carbonates precipitate out of solution, forming scale in pipes and tea kettles. In addition to narrowing and potentially clogging the pipes, scale prevents efficient heat

Solder reflow temperatures too high

Jan 14, 2007 | that will not reflow at normal temps cures the problem just enough to clean the old solder off or remove the component in question. R: This makes sense. Mixing an alloy with a lower liquidus temperature to a high melting temperature will lower the liquidus temperature of the higher melt alloy, because the new melting

Can you wave solder this part

Aug 22, 2006 | and the results are summarized in AN-1187. What is the standoff for this package after surface mount? a) Typically about 2 mils Can a "no" clean solder paste be used? a) Yes. Can we use a type 1 or 2 solder paste? a) No. These are not recommended for fine pitch. Type 3 or 4 is the recommended solder paste

Lead Free ...

Sep 6, 2004 | and the PCB's we use are OSP and we don't have any issues with the boards. However saying that we unpack the PCB's the same day they are to be used and if we need to clean a board it is put down the line straight away. From unpacking to wave solder this is generally completed in 3 days however we do have

lead free platings and tin lead

Aug 31, 2004 | connections for years. [And that's why the solder suppliers are recommending not using leaded parts with no-lead solder. So that when the failures start piling-up, they can say, "See we told them not to mix materials, like that, but did they listen? Nooo!!! Our hands are clean."]

Safety equipment for servicing solder wave

Aug 21, 2003 | cleaning, servicing even melding solder off of pump components and contains all the fumes to keep operators safe. You can find these type of systems from only two suppliers that I know of. One is Bliss Industries

Optimal Speed for Universal Chip Shooters

Jun 11, 2003 | Holes Clogged - check for grease in vacuum hole, also ensure nozzles do not have solder paste or glue inside of them. After cleaning perform necessary lighting and nozzle offset calibrations. 6. Nozzle Movement Sluggish- Clean nozzle and ensure nozzles slide up/down with free movement, replace nozzle

COB Process (Chip On Board)

Nov 5, 2002 | bonder machine,Gold or aluminum wire, Black epoxy, epoxy dispenser,weighing machine, Refrigerator,bond pull tester, ultrasonic cleaner, class 10000 clean room,vaccum line, trays or magazines for transporting the PCBs. The IC chips can be bought in either wafer / tray form. If you buy it wafer form then

baking boards, revisited

Oct 4, 2002 | . The result is disaster during stencil printing, the balls lift the stencil off the surface of the PCB. Only bake boards when rarely necessary and review the need periodically to avoid the unnecessary process stage. Often when you start to bake, it becomes the norm and in a couple of years everyone forgets

Immersion Ag

May 9, 2002 | the wave. * Solvents used for solder paste misprint cleaning do not appear to effect the solderability of the imm silver coating. * Insure that the imm silver PWB is completely dry prior to storage or processing. * Does imm silver eliminate migration issues associated with thick pure silver deposits? * Do

Hand Lotions

Mar 4, 2002 | Let me expand on Cal's comments. Recommended??? What people recommend depends on whom you ask and what is their motivation. Me??? There is no hand lotion recommended for use in electronics manufacture. Brian Ellis [a respected author on cleaning, bon vivant, and ex-SMTnter] once said �I

Wave solder question

Feb 19, 2002 | that "float" at wave, especially when using no-clean flux. * Shorter leads can help eliminate these defects at wave solder, sometimes. * Using weights to keep parts from floating: - Stuff the bags with anything that can take the heat exposure: glass [not plastic] marbles, aluminum pellets used in baking

Question on Nitrogen Consumption during Reflow

Jun 26, 2001 | on my web-site. Date: May 23, 2000 08:37 PM Author: Dave F Subject: Re: Nitrogen reflow Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine ," NEPCON West 1991 T Walsh, "The benefits Of Establishing A No-Clean Wave Solder System In Reducing Soldering Defects," NEPCON West 1991 G Schouten, "Benefits Of Inert Gas Soldering In Reducing Soldering Defects," NEPCON West 1991 H Hartmann, "Nitrogen Atmosphere Soldering," Circuits Assembly 2 (1), 60

No Clean

Jun 12, 2001 | The criterion you use will depend on the test method you select. For minimum requirements, look at

0201s

Apr 19, 2001 | +/- 50 Micron or better accuracy machine to give you acceptable PPM defect levels. I can show you the testing and math that proves this out. Please call me and I will go through this with you. Answers: SCREENING 1. Yes, type 5 if possible but type 4 will work 2. No-clean is O.K. 3. 4 mil

CIM systems and Final Assembly

Jan 23, 2001 | responsiveness, speed, AND quality within one environment, these systems are more of a necessity than a luxury. Each company has its own unique culture, environments, and budgets. It is important for you to select a software vendor with a clean and uninterrupted "migration path" through their software suite

Manufacturing Software

Jan 22, 2001 | software as applied in a sample CEM environment: First, CAD and BOM data is received by program management. The CAD file is sent to process engineering and the BOM is sent to configuration management. In configuration management, clerical personnel import the BOM into the system, clean common errors

Criteria for the Omega Mete from Alpha Metals Inc.

Jan 8, 2001 | and from company to company. MIL-P-55110 had a level of 6.5 by that method. Companies use anything from 1 to 8 by ROSE. These are also many cases where ROSE data showed squeeky clean boards, but experienced all kinds of corrosion and metal migration problems due to entrapped or absorbed residues which

SDRSS

Jul 20, 2000 | stages: Stencil Print Paste Side One Dispense Adhesive Side One Alternatively Screen Print Adhesive Side One (Using Recessed Stencils) Alternatively Dispense Paste & Adhesive Place Components Side One (Possible UV Curing Stage for Adhesive) Invert Board Screen Print Paste Side Two Place

Zero-Ion Ionic Tester

Feb 2, 2000 | Casimir: Resistivity of Solvent Extract (ROSE) testers measure ionic contamination by washing boards with a DI water/IPA solution. (No-clean people: Stop and go on to something else.) The testers are process control instruments used to monitor a relative contamination (cleanliness) level

VOC-free fluxes

Oct 13, 1999 | even less obvious, some of the acids (flux residues) can even slowly sublime at ambient temperature but, being solid, are not classed as VOCs, even though they are. So the "no-clean" residues also may cause smog. I grant you that their "volatility" is very low, but when you consider the total area

Immersion Gold

Oct 1, 1999 | and the wetting with no-clean under correct treatment are no matter of complaint. | | | | Give it a test | | | | Wolfgang | | | Wolfgang: I agree that this appears to be a cosmetic problem, but what kind of "paste printing" problem did your supplier have? What kind of print problem would prevent the paste

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Sep 30, 1999 | is the board fabrication process that removes smearing. (2) Drilling debris could be fiberglass threads that weren�t cut during drilling or any number of types of crud that drilling produces that the fabricator did not clean before plating. Drill sharpening and cleaning remove drilling debris. | 3. Smear

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Sep 30, 1999 | drilling or any number of types of crud that drilling produces that the fabricator did not clean before plating. Drill sharpening and cleaning remove drilling debris. 3. Smear and drilling debris prevent proper plating and fusing. 4. As Scott mentioned, LPI is not a "two-part epoxy screening type solder

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Sep 30, 1999 | expect about 25 �m of copper in through-holes which should be clean, without debris. It sounds like the solder mask is probably applied over a contaminated surface and is improperly cured. No way can you decontaminate what is under it. And don't pay the guy's invoice! Brian

Soldering to Gold

Sep 17, 1999 | fracture in service and some of these were in service for 15 years under fairly nasty climatic conditions. What I'm suggesting here is that cleaning + conformal coating MAY provide sufficient mechanical support to prevent them 'orrible intermetallics from causing cracking if you don't pre-tin but

Re: Best reflow temperature

Sep 16, 1999 | | | | Hi, | | | | | | Can someone pls suggest to me the best reflow temperature setting | | | for a force air convection oven. The details is as follow. | | | 1) Heller 1700s | | | 2) 12 zone---6 top and 6 bot | | | 3) Solder paste --- Qualitek 691 non clean | | | 4) board size : 159mm X 159mm

Electronic manufacturing company near the beach.

Sep 16, 1999 | they are rained out (i.e. a drop of rain actually hits them) they will remain in suspension, at the vagaries of any wind or air current. Only a class 100 clean room would be reasonably proof against them. | | If ionic contamination on your assemblies is likely to be a serious problem, my advice is to go inshore

Product Segmentation in Pick Place Machines?

Sep 11, 1999 | | | | Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | | | | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and high-range automatics. In p

I wonder

Sep 10, 1999 | critical measurement decision is deciding what to use as the reference plane. Our tools had trouble with soldermask so we used the land for the reference plane for measuring. This is usually OK because the apertures are reduced and the land is the highest point on the board so the stencil is resting

Electroless Tin Plating

Aug 23, 1999 | depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric current to "build-up" a coating. This tin coating ranges 0.7-1.0 �m (30 to 40 micro inches). Now here�s the rub

Bridge on BGA

Aug 20, 1999 | . | | Now, when your bridging is caused by this normal warpage problem, your solution is great. | | However, there can be other reasons for shorts. For example, after removal of the defective part you may damage the solder mask when cleaning the site, so you may have small areas of exposed copper between

Bridge on BGA

Aug 20, 1999 | is caused by this normal warpage problem, your solution is great. | However, there can be other reasons for shorts. For example, after removal of the defective part you may damage the solder mask when cleaning the site, so you may have small areas of exposed copper between BGA pads, very close to the pads

Bridge on BGA

Aug 20, 1999 | is caused by this normal warpage problem, your solution is great. | However, there can be other reasons for shorts. For example, after removal of the defective part you may damage the solder mask when cleaning the site, so you may have small areas of exposed copper between BGA pads, very close to the pads

Parylene Coating of Plastic Parts

Aug 5, 1999 | components as you MUST leave these legs "clean" to ensure good soldering. The coating will not therefore give you any process advantage - only extra cost. | | BTW, why Paralene? Why not use a more conventional material? Can you elaborate? | | Hope this helps, Regards Graham Response to Graham from Dave

BGAs and vapor phase

Jul 20, 1999 | with 205�C in a batch-system with infrared preheating and second preheating-stop in the unsaturated vapourzone. | | | We use 8 layer multilayer-boards in Ni/Au and no clean 63/37 paste. | | | All I hope is that our subcontractors do a similar good job with their convection-systems. | | | | | | Wolfgang

Wave solder edge covers

Jul 2, 1999 | that's not likely. Try the Kapton tape to eliminate the possibility of the flux being the problem and see what happens. There are cheaper tapes that will survive. I use the Stevens (?) finger covers every day but only on gold and with no clean. Could there be some sort of contamination inside

Wave solder edge covers

Jul 2, 1999 | that's not likely. Try the Kapton tape to eliminate the possibility of the flux being the problem and see what happens. There are cheaper tapes that will survive. I use the Stevens (?) finger covers every day but only on gold and with no clean. Could there be some sort of contamination inside

Defluxing Advanced Packages

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