Electronics Forum | Tue Nov 08 12:05:57 EST 2016 | aemery
Lachrymal, Where are you getting that from. Let me keep this simple because there can be so many variables in modern printing, some you can control and some you can't. Unless you are designing your own PCB's where you can decide how to orient the co
Electronics Forum | Mon Aug 06 14:12:49 EDT 2018 | tey422
I just found out we are unable to epoxy it. As the customer need to pull it up and open to tune the product. Which means the only way to solve it is by fine tune the pad and/or stencil design.
Electronics Forum | Thu Sep 06 05:43:15 EDT 2018 | cmchoue
Thank you Mr.Spoiltforchoice, My question is not clear , let me show you a photo Did you have any suggestion? Thanks James
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice
You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g
Electronics Forum | Tue Feb 15 13:16:02 EST 2000 | Rob Fischer
Don't feel alone. Many assemblers have the same problem but aren't fortunate enough to have say in the design of the board. They're either have a capital invedtment in a selective solder machine or pallets designed to mask bottom-side SMD. The pal
Electronics Forum | Mon Aug 06 16:33:52 EDT 2018 | tey422
If I understand customer's intention correctly, it would be fastest, mass production with fully utilizing the Pick-N-Place machine capacity with minimum manual labor which won't break the bank. They used to manual hand soldering the coil to the boar
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Tue Jul 21 21:09:49 EDT 1998 | Steve Gregory
>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b
.gif)
