Electronics Forum | Fri Jun 22 10:56:07 EDT 2007 | ed_faranda
5mil works great. Just make sure that you screen alignment is dead on. We're using a SAC305 with a home plate design. I ran a test a couple of months back and found that the home plate design works the best with 0402s.
Electronics Forum | Thu Aug 22 16:13:47 EDT 2019 | scotceltic
I have to agree with Dave here. Can you compare the datasheet pad recommendations to your design ? It may help to show the forum a picture of the bare PCB pad design along with a pic of the bottom terminations on the part. What Stencil thickness a
Electronics Forum | Fri Sep 11 00:52:09 EDT 2020 | rsatmech
Thanks for your response. I am reducing the stencil opening and ensuring no solder paste deposited at the cornor of the pad. Not moving to homeplate design considering the component size. Will share the exact design.
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
Electronics Forum | Thu May 30 09:55:52 EDT 2013 | rgduval
I like AIM solder paste, personally. But, much like asking which pick and place machine is best on this board, you're likely to get as many opinions as there are paste manufacturers. I just took a look at Alpha's datasheet for this product, and it
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Mon Aug 30 11:20:12 EDT 1999 | John Thorup
| | | Planning to evaluate the above process... | | | Can anyone can give me some tips/infos on the above.... | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile diff
Electronics Forum | Mon Aug 30 12:02:16 EDT 1999 | Brian Wycoff
| | | | Planning to evaluate the above process... | | | | Can anyone can give me some tips/infos on the above.... | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profil
Electronics Forum | Tue Aug 31 03:37:19 EDT 1999 | Wolfgang Busko
| | | | | Planning to evaluate the above process... | | | | | Can anyone can give me some tips/infos on the above.... | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
