Electronics Forum | Mon Mar 14 18:20:50 EST 2005 | yoman
I'm trying to develop an spc chart for the stencil printing process but don't know which direction to go. Any suggestion?
Electronics Forum | Fri Apr 02 05:06:49 EDT 2010 | atchoum
Hi, I'm looking for an adhesive which can be stencil printed, in order to assembled PET (top layer) with Glass (bottom layer) for resistive touch panel application. The adhesive should be deposited at the border of bottom &/or top layer. Do you know
Electronics Forum | Fri Sep 26 10:47:56 EDT 2003 | davef
The metals used to replace the lead weigh less than the lead.
Electronics Forum | Thu Sep 25 13:53:56 EDT 2003 | russ
There isn't any difference in the printing process regarding leadfree vs. lead. The only differences are in the reflow process. Russ
Electronics Forum | Wed Mar 27 12:37:12 EST 2002 | jax
Barry, If you are looking to set up a documented process with set parameters you might think about performing a DOE based on the parameters you can control or change. With any measurement device you should be able to log the info gathered so you ca
Electronics Forum | Mon Mar 14 18:32:46 EST 2005 | russ
what did your D.O.E. studies show you as the critical parameters? These are the ones that you need to measure. If you did not perform DOE than you probably should prior to putting an SPC chart out there. What type of measurement capabilities regar
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Tue Mar 15 19:17:26 EST 2005 | yoman
Thanks for your reply. We are using EKRA E4 Inline Automatic Stencil Printer. It is Capable of Automatic stencil inspection. 2D solder coverage inspection. Fix Squeegee angle at 45 degees angle. Programmable squeegee speeds and pressure, boards snap
Electronics Forum | Fri Sep 26 08:28:24 EDT 2003 | successmani
Thank you Russ for the information. One more clarification- I found that the %metal content in lead free paste is in the range of 88-89.5 whereas %metal content in Sn-Pb paste was 90% in general. What is the reason behind this reduction of %metal co
Electronics Forum | Thu Sep 25 12:59:14 EDT 2003 | successmani
hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering would there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". Thedensity of Sn-37Pb
