Electronics Forum | Fri Jan 10 13:21:34 EST 2020 | emeto
Yes, think of 3prints/minute 24 hours. This is about 4000 prints a day. than you have a marginal process, because customer locked design and doesn't want to change anything. So in our case for 70k-100k prints and we had to change them as the perform
Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
Electronics Forum | Thu Aug 12 20:31:57 EDT 1999 | Kelly Morris
| | Hello | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | 100 durometer blade. Getting "tails" o
Electronics Forum | Thu Aug 12 20:48:05 EDT 1999 | JAX
| | | Hello | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | 100 durometer blade. Getting "
Electronics Forum | Thu May 17 09:01:01 EDT 2012 | scottp
I'm not sure why anyone would pay extra for FG (fine grain) stencils. I've run studies comparing traditional YAG laser, fiber laser, and E-form stencils with regular stainless, FG, and nickel foils. YAG is the worse and should only be used for pret
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
