Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Wed May 23 15:58:01 EDT 2018 | mcurtin2011
Those patterns are either: a) the stencil has recieved some streching stress - either being pushed on and dented by some obstruction, or b) has been worn thin and therefore streched as a result. This type of change to your foil may cause a slight sh
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Thu Nov 05 23:24:56 EST 2020 | neosroger
I would like to request your expertise on which pasta printer to purchase: MPM Momentum + EKRA XPRT 3 Both of them are refurbished/ reaconditoned. The MPM includes several perpetual Software licenses but it is almost double the price of the EKRA
Electronics Forum | Tue Apr 01 11:18:47 EST 2003 | cyber_wolf
Is anyone out there successfully screen-printing SMD adhesive on an 0402 layout? We have successfully done 0603 and larger, but the deposition consistency on the 0402's is just not there. We don't always get enough epoxy on the board. We have tried a
Electronics Forum | Mon Dec 13 05:43:27 EST 1999 | Wolfgang Busko
Hi Steve, 20 mil pitch shouldn�t be that problem nowadays. In your case bridging and poor wetting seem to go hand in hand. For the poor wetting try to eliminate it by using different paste (higher activated) and work on your profile. Coplanarity also