Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug
| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f
Electronics Forum | Wed Feb 16 09:30:11 EST 2000 | MARK ALDER
Please refer to the archives on SMTNET date 02/19/1999 on aperture sizes for printing SMD adhesives. Regards Mark Alder
Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon
| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Sun Dec 08 23:40:19 EST 2002 | nonotalent
Hi all, We are currently having problems with > a laser-cut stencil that is electropolished and > nickel plated with 9-mil openings. The paste > does not release well from the apertures. We are > having to wipe after every print. The board is >
