Electronics Forum: stencil (Page 241 of 572)

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam

Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V

Best Jet Printer? MY600?

Electronics Forum | Wed Jan 27 15:23:25 EST 2016 | dyoungquist

You can buy an awful lot of stencils for $200K but where/how are you going to store all of those stencils? There is a certain $$$ value to all the space it will take to store them. I have been told by a Mycronic salesman that they are working on qu

Stencil Manufacturer

Electronics Forum | Fri Mar 10 11:29:46 EST 2017 | mmjm_1099

What part of the country are you located? I know numerous stencil manufacturers in the country that I could refer you to. The one we currently use is Stentech and guarantee next day delivery for basic laser cut stencils. They have always kept their w

CAM350 v12, DFMStream paste mask checks

Electronics Forum | Tue Apr 18 07:46:30 EDT 2017 | pavel_murtishev

Dear PCBFOX, I use CAM350 v12.2 build 1135. I am trying to use CAM350 DFMStream module for paste mask layer check. Examination I am interested in most of all is "Paste Mask Layer Check - Missing Paste Mask on SMD Pads (MP)", i.e. missing stencil ape

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt

IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 15:06:54 EST 2017 | emeto

I am not sure that is doable. Ground Aperture is very small(for the stencil blade to get in there) and very close to the other apertures. I want to say the minimum requirement for step is 6mm clearance from other apertures for the stencil houses that

Step-up stencil: recommendation thickness

Electronics Forum | Tue May 21 15:36:22 EDT 2019 | gregoireg

Thanks to @davef and @Evtimov for trying to help. It's useful but not exactly the answers I would like to get. I'm going to reformulate my question. I'm writing in mm so that it's more precise: I have a 0.12mm-thick stencil for some 0.4mm-pitch QFN

solder ball

Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas

It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Wed Mar 18 11:27:24 EDT 2020 | slthomas

I am about to order a stencil and I can already see that I'm going to have issues. I'm hoping someone has a recipe for this scenario that we haven't tried yet. The parts are 16 mil pitch bga's, the pads are NSMD (10 mil dia. with 12.6 mil mask open


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