Electronics Forum: stencil (Page 246 of 540)

Re: cleaning glue off of stencils

Electronics Forum | Wed Mar 08 09:32:57 EST 2000 | Dane Stokes

We use loctite to print with before begining testing on printing we asked loctite for the best cleaning solvent for there product. loctite had there own solvent that was designed to break down the propertys of their glue mix. Contact glue supplier an

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

Re: 0402 components

Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX

Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).

Re: Squeege Snap off

Electronics Forum | Fri Jan 12 17:24:02 EST 2001 | darby

SQUEEGEE snap off is the gap between the top of the stencil and the the bottom of the squeegee blades. You can measure it with a set of feeler gauges.

Squeege Snap off (MEASURED?)

Electronics Forum | Mon Jan 15 08:24:32 EST 2001 | adrian

I thought the stencil was flush to the top of the board when Screen printing. When does this snap off occur in the screen printing process?

Squeege Snap off

Electronics Forum | Sun Jan 28 21:50:22 EST 2001 | Dreamsniper

Hi Adrian, If you do a "squeegee snap off" during solder paste printing...the result would be a very thick solder paste deposition. I think the correct term is stencil snap off or people say it "snap off distance". =)

Solder Paste Height

Electronics Forum | Fri Jan 05 19:47:08 EST 2001 | slowe

Hey everyone, Does anyone out there use a solder paste height measuring system ? I would like to know what the standard is for paste height compared to stencil thickness and how you use it as a process tool. I appreciate any help. Thanks, Steve.

Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris

I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90

Re: Glue a SOT223?

Electronics Forum | Wed Dec 13 20:22:37 EST 2000 | Dave F

George We use a 0.030" dot. Here's a link for aperture sizes for adhesive printing from Alpha. http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html Here's a link for aperture sizes for adhesive printing from Heraeus. http:/

Squeegee cleaning

Electronics Forum | Wed Dec 06 09:29:31 EST 2000 | Kris W

Happy Holidays to all! Has anyone seen or heard of an automatic cleaner for squeegee blades and holders? I searched the archives and found nothing! I simply don't want to tie up the stencil cleaners with squeegees! thanks, Kris

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