Electronics Forum | Mon Nov 24 08:02:12 EST 2008 | realchunks
The Mydata machine is very cool. It is a bit slow but is perfect if you want to do small prototypes. But I don't think a manager that spouts crapulants like that will buy a machine like this. Too forward thinking for his brain.
Electronics Forum | Wed Dec 03 09:02:18 EST 2008 | realchunks
They make manual printers that fit 29X29 inch stencils. We use one every day. It's an old Svecia model.
Electronics Forum | Tue Dec 09 12:26:45 EST 2008 | greene08
I have virtualy no experience with placing bottom side components. We have a new board coming that will have a few R's & C's bottom side. Can anyone give oppinion on dispensing glue dots vs. applying adheasive with a stencil ? thanks
Electronics Forum | Wed Dec 24 20:29:45 EST 2008 | xianhua_tang
Oh,I consider the process is wrong,it is stencil print paste-mount-reflow -apply glue-reflow,then wave solder. it must pass twice reflow,also the first reflow profile is different and the second .
Electronics Forum | Wed Jan 21 06:09:37 EST 2009 | gregoryyork
Try a typical Stencil Cleaner with Glycol ether mix as probably solder resist residue depositing back onto the pads during levelling. Cheers Greg
Electronics Forum | Wed Jan 21 03:34:05 EST 2009 | mrdtech
Sorry if that sentence there was not really clear. I meant: don't to try to 'revive' old paste or paste that has been on the stencil for a very long time using fresh paste.
Electronics Forum | Wed Feb 04 08:36:54 EST 2009 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=38821
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Mon Mar 02 08:25:08 EST 2009 | jorge_quijano
Thanx for all your recomendations, we already ask for a 3D SPI and help us well, we are asking for a ultrasonic stencil cleaner. By the way how do you deal with the 'head in pillow' defects? is there a solder paste alloy / profile issue?
