Electronics Forum | Mon Nov 29 16:36:31 EST 1999 | Curtis T.
Jason, We have been running both the high pressure and the ultrasonic washers for several years and there is no comparison. The ulrtasonic (smartsonic) does a great job on all the normal pastes, and when we changed part of our production to a new ep
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Fri Oct 22 21:35:54 EDT 1999 | se
It's IIT, not ITT. DEK in the UK also uses a tensioning frame, but I don't know of any suppliers in the US. As a stencil vendor without a quick mount/re-usable frame to sell, I can say that I have not heard many complaints regarding print quality o
Electronics Forum | Tue Sep 21 13:25:18 EDT 1999 | Dave F
| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |
Electronics Forum | Tue Sep 21 15:31:05 EDT 1999 | Hugh Martin
| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Sat Aug 28 15:43:56 EDT 1999 | ScottM
| Recently, our solder dross reclaimer refused to take our | used solder paste tubes. He said the small percent of paste | remaining in the tube is now considered hazardous waste. I'm interested in advice on how others are disposing of this "hazardou
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
