Electronics Forum: stencil (Page 436 of 540)

Reworking BGA's

Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon

Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the

screen thickness

Electronics Forum | Wed Jan 25 18:31:05 EST 2012 | kahrpr

A few years ago a lot of stencils were 6 mill and 7 mills and a lot of people still use them. these days with such a hi mix on the boards 5 mill seems to be a good compromise. if the 6 mills is working for you that's fine. One thing to note as you go

solder paste control

Electronics Forum | Wed Mar 14 16:10:38 EDT 2012 | cobham1

We need to develop a method of putting solder paste on a stencil then putting the unused part back into the refrig. Reason we are thinking of this method is because we only run circuit boards twice a week. I dont want to waste entire jar of paste bec


Electronics Forum | Thu Mar 22 10:07:48 EDT 2012 | hussman

We chose the MPM over the DEK. We did real world comparison in our factory with both machines almost side by side last year. MPMs offer a real windows based software that basically takes the operator out of the equation. Besides the basic screen p

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon

Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w

Entry-Level PnP + BGA?

Electronics Forum | Mon Jul 29 10:44:48 EDT 2013 | stevevb

Greetings! TWS Automation has the perfect machine for your needs. The Quadra DVC is an inexpensive, vision system centered, 0201 capable, Pick & Place machine with 3300 cph max speed. A complete line, including a TWS Automation Stencil Printer and Re

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 10:42:09 EDT 2012 | saju86ece

Hi, I need one clarification about solder paste printing height tolerance. How to define and fix the solder paste height tolerance after screen printing for inspection purpose. Currently we are using 5mils thickness of stencil, in that we are gave

63/37 Solder Paste mix

Electronics Forum | Thu May 10 22:16:51 EDT 2012 | davef

It's bad practice to remix used solder paste with new solder paste in the jar. Further, some would argue that it's bad practice to reuse solder paste period. If economics force you to reuse solder paste, store it for reuse in an empty jar. When rea

SMD LEDs stick to nozzle while mounting

Electronics Forum | Wed May 23 18:53:20 EDT 2012 | stentech

Pick and place is not my area but I did have a customer a while ago with a similar problem. He did try different nozzles and air pressure. They use Nano protek on thier stencils. He wiped the nozzles with Nano Protek and the problem dissappeared. Onl

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