Electronics Forum: stencil (Page 451 of 572)

Squeegee angles

Electronics Forum | Tue Mar 14 09:54:34 EST 2006 | slthomas

"45* is a common angle of attack. Squeegee blades are commonly manufactured at 60*. The combination of the angle of attack and the blade angle results in an actual printing angle between the two due to down pressure and flex of the blade." Ahhhh, so

Fighting solder beads

Electronics Forum | Tue Mar 21 21:03:55 EST 2006 | davef

1 Chatter about mask opening � No BIG problems with these statements. It�s just that you may need to tailor your reflow recipe to minimize these escapees. 2 Stencil design - Any area ratio below 0.66 is going to very challenging to print, as you ca

Screen Printing

Electronics Forum | Tue May 02 13:32:53 EDT 2006 | marvindamaniac

We are using a Metal Screen. We used a metal screen in the past and found that stencil life wasn't a problem. We are a Low Volume, High mix spot where the average lot size is no more than 100 pcbs and as low as 5 pcbs. I am concerned with wiping i

Solder joint issue

Electronics Forum | Thu May 18 11:00:51 EDT 2006 | Chunks

Thanks Doctor - as always, you're right. I must've been typing with my mittens on. It's starting to get cold on this part of the planet these days. I wasn't blaming anyone, just trying to take a few questions marks away so "we're" left with the an

fine pitch printing

Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas

Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r

Poor soldering on fine pitch?

Electronics Forum | Fri Jun 09 15:41:59 EDT 2006 | shawnvike

That is the problem I am having! Except with 3 separate manufacturers. To answer some of the other questions... Baking - diligence Stencil - as far as we can tell it is good Placement is good We are using Pb-free parts and solder, but I have see

can i use fcp6 machine for glue

Electronics Forum | Thu Jun 15 05:48:20 EDT 2006 | greg_diaz

Your concern should be do you have a glue process that can keep up with the FCP6. We ran a GL541 in line with a CP643 which the glue machine was actually a bottle neck because if you run SOIC's which require more glue dots then it will slowdown the

time/pressure dispensing

Electronics Forum | Fri Jun 23 01:19:19 EDT 2006 | Ola

Yes, leadfree paste is dispensable, but there is a completely diffrent paste than one will use at the stencil printer in the line. This is a very tricky one to deal with. We use xxx lf-free paste in the line, but that paste will Not at all work at th

Ekra Stencil Printer

Electronics Forum | Thu Aug 03 10:13:41 EDT 2006 | wrongway

Hello Rush fan we have a Ekra E5 had it about a year the only thing I dont like is the foil on top of the doard holders you can take them off but if your board is warped then it dosnt clamp the board and it will fail the vision but we hav

SAC305 Solder Balling

Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com

I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli


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