Electronics Forum: stencil (Page 486 of 572)

Re: all powerfull UP78..or is it..?

Electronics Forum | Fri Apr 30 11:03:27 EDT 1999 | Wade Oberle

| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the

Re: Washing boards with paste...?

Electronics Forum | Tue Sep 15 12:11:36 EDT 1998 | Bill Schreiber

Jeff, The use of flux thinner would only add another chemical to the process. Environmentally, that would not be a good idea. My guess is that you would only end up with "thinner jelly" anyway. Alcohol works well on RMA flux. When assemblers switch f

What's The Waste?

Electronics Forum | Tue Feb 20 13:10:54 EST 2001 | billschreiber

Hello Dave, Before I get into waste management, I must first stress the importance of checking with your local regulating agencies. Every area can be and usually is different. California regulations differ from Ohio and Ohio�s are different than Mu

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup

| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem

Re: Solder Beading Solder Balling

Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW

| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi

Re: BGA Shorting problem

Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach

| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th

Post Script

Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike

| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.

Tombstone

Electronics Forum | Tue Aug 28 13:08:28 EDT 2001 | seand

Hello Everyone, Mountains and mountains of data in the archives. As a contractor the variables in your production lots don't help I'm sure. On a larger scale, one suggestion maybe to first look at when and where your tomb stoning is occuring. 1

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b


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