Electronics Forum: stencil (Page 486 of 540)

BGA

Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk

HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi

Fine Pitch Printing Issues

Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis

I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I

Looking for Used low-end P&P machine

Electronics Forum | Tue Jun 08 17:31:15 EDT 2010 | whitewing

For protos and very short runs I already use a polyester stencil + pizza oven process which is fine except for the placement time and tedium. I'm partly trying to bridge the gap between that and stuff that needs subbing out due to quantity, and partl

QFN voiding levels

Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman

Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages

PCB bows after wave soldering

Electronics Forum | Fri Jun 18 17:36:10 EDT 2010 | sid

Good afternoon all, I have been trying to find a solution to a defect I just noticed. After stencil printing and smt part placement on the secondary side of my boards, I run them through a wave soldering system. All my components got soldered perfe

BGA non wetting

Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22

Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp

Best way to ensure max solder load on SOIC w Thermal Pad

Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising

Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without

Using Vapour Phase Soldering Process

Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp

Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s

BGA Reflow

Electronics Forum | Wed Jun 08 13:41:56 EDT 2011 | swag

Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter from the side with a scope? From your x-ray, it appears you are correct in saying they are collapsed as the balls get smaller in a uniform fashion as you


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