Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk
HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi
Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis
I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I
Electronics Forum | Tue Jun 08 17:31:15 EDT 2010 | whitewing
For protos and very short runs I already use a polyester stencil + pizza oven process which is fine except for the placement time and tedium. I'm partly trying to bridge the gap between that and stuff that needs subbing out due to quantity, and partl
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Fri Jun 18 17:36:10 EDT 2010 | sid
Good afternoon all, I have been trying to find a solution to a defect I just noticed. After stencil printing and smt part placement on the secondary side of my boards, I run them through a wave soldering system. All my components got soldered perfe
Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp
Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Wed Jun 08 13:41:56 EDT 2011 | swag
Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter from the side with a scope? From your x-ray, it appears you are correct in saying they are collapsed as the balls get smaller in a uniform fashion as you
