Electronics Forum: stencil and tension and gauge (Page 1 of 1)

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 10:00:00 EDT 1998 | EFData

The quick frame does work well with the DEK 265, but we feel that tensioning is user dependent and introduces variation into the process on an operator to operator basis. Also, because tensioning occurs only on two sides (instead of four) this also i

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry

We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 12:01:16 EDT 1998 | Chrys

Have you tried the new Accu-Frame from PNC? It tensions on all four sides using an operator-INdependent mechanical scheme. It seems pretty slick. They're failry new, and don't have a frame for the MPM's last time I checked, so I haven't tried it m

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 19:55:00 EDT 1998 | D. Lange

| Have you tried the new Accu-Frame from PNC? It tensions on all four sides using an operator-INdependent mechanical scheme. It seems pretty slick. They're failry new, and don't have a frame for the MPM's last time I checked, so I haven't tried it

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS

Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice

Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl

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