Electronics Forum | Wed Dec 11 13:00:07 EST 2019 | slthomas
Excessive mask thickness also can wreak havoc on stencil printing.
Electronics Forum | Wed Jan 05 16:46:44 EST 2000 | Dennis O'Donnell
Several methods work well. 1. (Low Volume Method) Using an Xacto blade, scrape off the solder mask holding the blade flush being careful not to use the pointed part of the blade. 2. (High Volume Method)Tape off the area that you don't want the mas
Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.
One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the
Electronics Forum | Tue Apr 18 07:46:30 EDT 2017 | pavel_murtishev
Dear PCBFOX, I use CAM350 v12.2 build 1135. I am trying to use CAM350 DFMStream module for paste mask layer check. Examination I am interested in most of all is "Paste Mask Layer Check - Missing Paste Mask on SMD Pads (MP)", i.e. missing stencil ape
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Mon Jan 25 13:51:07 EST 1999 | Parvez PAtel
Steve i agree with u. we use kapton tapes for test puproses at our facility and they do not interfere with the printing results. Infact we sometimes use it to mask off unwanted apertures on stencil underside. But could their applcation affect the gol
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 16:54:57 EDT 1999 | Scott Cook
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Tue Jun 14 14:03:01 EDT 2022 | emeto
Would advice to mask only for trial. Cut the proper stencils is the solution.
