Electronics Forum: stencil thickness and ball pitch (Page 1 of 11)

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000

What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

Stencil thickness

Electronics Forum | Thu Mar 02 13:04:22 EST 2006 | Chunks

0603 parts at .2mm spacing is pretty easy. But are there any other parts, like fine pitch QFPs? Is your board HASL or something else? Is there resist/mask between all pads? If it's just 0603's at .2mm, then you can probably go 7 mils and get good

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto

I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg

I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH

1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M

I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5

Solder Paste and fine pitch components

Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno

Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar

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