Electronics Forum | Wed Aug 05 14:55:15 EDT 1998 | john
Probably should have been more specific. We want to do some stencil etching. Mainly for prototype work nothing too high volume. Thanks, Oh yeah, (Ben) and maybe a tattoo here and/or there.. Ha ha ...
Electronics Forum | Thu Oct 21 08:25:23 EDT 2004 | fcox
What are the most common solvents/processes being used to clean paste from metal stencils? Any heat?
Electronics Forum | Fri Oct 22 07:35:02 EDT 2004 | davef
Most glue suppliers recommend chemicals and methods for removing the product from stencils. What does yours suggest? Further, search the fine SMTnet Archives for background discussion.
Electronics Forum | Mon Nov 01 08:34:06 EST 2004 | fcox
What I am really after is what is recommended to clean the paste from the stencil. What works best? What is really used in common practice?
Electronics Forum | Wed Aug 12 16:13:48 EDT 1998 | Alex Ondi
:Try American Plating Systems for Chem Etch Equipment, LPKF (Germany)for Laser cutting systems (A Laser in Oregon is the local distributor for LPKF), Lumonics is another option for Laser cutting systems. Probably should have been more specific. W
Electronics Forum | Fri Nov 05 17:29:53 EST 2004 | Steve Stach
Most metal stencils today are cleaned with a water based cleaning solution. 3 choices are most typical: (1) Water only for water-soluble paste (2) Water + Organic for rosin and no-clean (low residues. This affords lower temperatures and is easier t
Electronics Forum | Mon Nov 01 09:43:52 EST 2004 | russ
See Daves Answer above and change it to "paste mfgr." Also most all of the cleaning companies have chemistries. Are you cleaning noclean or W.S.? IPA works if you clean them manually, Or the chemicals that the Ultra sonics mfgrs recommend. Search
Electronics Forum | Mon Nov 25 12:32:20 EST 2002 | davef
Now that is a BIG step. Stencil type: * A metal squeegee is fine with stepped stencils. * A rubber squeegee is fine with stepped stencils. Comments on step stencil "keepouts" are: * Use an ample space around the stepped down component pads that is
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Fri Nov 07 01:01:55 EST 2008 | mskler
What should be stencil size to reball the BGA of 0.6MM ball dia.
