Electronics Forum | Tue Apr 15 10:43:44 EDT 2003 | yngwie
Why is it people still prefer to do manual stirring of solder paste versus automated solder paste softener ? I learned that one of the dis-advantage of using the softener is that this method is actually seperating the metal and flux. Is there any oth
Electronics Forum | Tue Apr 27 00:18:08 EDT 2004 | Garian
Since you have used malcom softener, did you encounter and sudden rise of void level in the solder joints as compared to manual stirring?
Electronics Forum | Thu Jun 08 21:13:37 EDT 2006 | fastek
Come on guys......Guru and Shocker are the same guy and he is a troll (someone who simply wants to stir up the pot by making outrageous comments). By ignoring him...he will go away. Replying to him is like throwing gasoline on a fire.
Electronics Forum | Mon May 14 17:16:27 EDT 2001 | slthomas
We use both, cartridges for water soluble and jars for no clean. The only reason we do is so they can't possibly (knocking on my head) mix it up. Pros: Jar - you can put paste back into it if you want to wash your stencil, change jobs after lunch,
Electronics Forum | Tue May 01 15:39:34 EDT 2001 | blnorman
Anybody else out there using LR-737? How is it packaged? We're using it in Semco cartridges which include a dasher and stir rod (used because the paste and flux separate relatively easily). If you are using it in this configuration, do you get a p
Electronics Forum | Sun Jan 23 13:36:05 EST 2000 | Mike Gamble
Would anybody like to tell me which is the best show. Reson for asking is I am in South Africa and cannot attend both (time/cost etc!) We are a contract facility and I therefore would like to attend a show that has as broad a scope as possible. Hope
Electronics Forum | Fri Nov 08 14:57:43 EST 2002 | slthomas
What I was told is that the stirring is intended to promote some shear thinning, not to redistribute the flux. The cartridges (and I'm assuming the syringes, too, if you're differentiating between the two) alledgedly introduce some shear thinning ju
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Mon Nov 08 15:14:46 EST 2004 | russ
In addition to type of paste, it is also dependant on the enviroment conditions. When you say open jar are you implying that the jar is left open all day and then at the end of shift it is closed back up? Jars should only bve open for about 30 secs
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
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