Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Fri Aug 20 13:36:46 EDT 2004 | ttye01
We conduct temperature stress test (-40 to +100C)on our products which sits on our expensive test board. This stress test on our product shorten the life span of the test board due to the extreme temperature change. I have tried epoxy coating on the
Electronics Forum | Sun Aug 22 22:31:31 EDT 2004 | ttye01
Hi Dave, Thanks for the input. Will certainly take your advice. Thomas
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv