Electronics Forum | Thu Jul 17 12:51:46 EDT 2003 | James
Any suggestions on trying a paste with a stronger flux?
Electronics Forum | Wed May 26 08:40:01 EDT 2004 | vickt
The Universal / Hitachi partnership is stronger than ever! Joint Ventures and other cooperative arrangements are now the norm in any industry and make product offerings much stronger. Our partnership is long term and dates back to 1989. Our most rece
Electronics Forum | Tue Jun 06 15:01:10 EDT 2000 | Charles Harper
The homologous point is the temperature midway betweeen the melting temperature (of the solder) and absolute zero. Below this point the solders are harder, stronger, and more resistant to fatigue. As solders are exposed to higher temperatures above
Electronics Forum | Thu Jun 20 08:23:19 EDT 2002 | davef
Either you need a stronger flux or the solderable surfaces need to be reconditioned. Most board fabricators don't do reconditioning. Search the fine SMTnet Archives for discussion on ROSA. EMPF is one place that does ROSA on a contract basis.
Electronics Forum | Mon May 19 02:36:25 EDT 2003 | Thomas
Hi Grant, From what I know, it has something to do with the flux...Imagine if the temp difference of the flux is somehow slowed down..it would reduce the tendency of a stronger pull on one side of the pad...
Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew
Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds
Electronics Forum | Sun Jan 24 10:49:38 EST 1999 | Ng
It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come w
Electronics Forum | Fri Feb 13 03:26:07 EST 1998 | Brian S. Bentzen
Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Sun May 12 23:40:03 EDT 2002 | caldon
Both are good machines. I think the variable here is : 1)The topaz has been around longer and more time to be refined. 2) Support structure- I give the nod to Assembleon for this one. They have a stronger Apps and FS devision. Are these the only two
