Electronics Forum: structural test (Page 1 of 7)

Is there a cross section standard test method...

Electronics Forum | Tue Mar 25 07:33:46 EDT 2008 | davef

References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analys

PASTE DRYING OUT ON STENCIL

Electronics Forum | Thu Feb 10 09:42:42 EST 2011 | davef

Some solder paste formulations can be frozen with no effect. Other formulations ... not so much. Can you compare this questionable solder paste with 'known good' paste of this part number in a structured test?

Intercomnect Characterization

Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong

Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef

Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of

Re: "Superboy" needs HELP

Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach

| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te

Flying Probe Evaluation

Electronics Forum | Tue Feb 26 11:07:21 EST 2013 | capse

hi, First, I'm the Acculogic Rep in the southeastern US. They have an Applications Manager I work with named Vaughan Carlson. Vaughan has run his own test service company. He has worked with my customer on structuring FPT evaluations. His number is 2

0402 Testing

Electronics Forum | Fri Jul 10 01:50:53 EDT 2009 | jan_mancelita

> Hi, do you know where and how we can tests > 0402 > ceramic capacitors? We would like to > test them > individually before we place > them on our board; > so as to get some test > yield and the distribution > of the > parameters of this c

0402 Testing

Electronics Forum | Thu Jul 09 08:34:14 EDT 2009 | rway

Hi, do you know where and how we can tests 0402 > ceramic capacitors? We would like to test them > individually before we place them on our board; > so as to get some test yield and the distribution > of the parameters of this component based on

Chemical Reaction

Electronics Forum | Sat Jun 23 07:34:26 EDT 2007 | davef

This sounds like a form of corrosion called electromigration. It creates cathode anodic filaments. They have a fern like shape because it is a metallic based crystal structure. Electromigration requires: * Difference of electrical potential * Chemica

Re: 0603 Components

Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko

Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath

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